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A kind of anodization process of metal substrate for carbon nanotube growth

A metal substrate, carbon nanotube technology, applied in metal material coating process, anodizing, gaseous chemical plating and other directions, can solve uneven distribution, difficult to control the diameter of carbon nanotubes, increase the difficulty of strong adhesion of carbon nanotubes, etc. question

Active Publication Date: 2017-09-19
WENZHOU UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, due to the smooth surface of this type of substrate, the local curvature radius is large, which increases the difficulty of growing strongly attached carbon nanotubes.
At the same time, this type of substrate has a large catalyst content, and it is difficult to control the size of particles or aggregates split on the metal surface when heated, and it is difficult to control the diameter of carbon nanotubes, which may easily cause poor crystallinity, uneven distribution, and obvious marginal growth effect of carbon tubes. Not enough

Method used

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  • A kind of anodization process of metal substrate for carbon nanotube growth
  • A kind of anodization process of metal substrate for carbon nanotube growth
  • A kind of anodization process of metal substrate for carbon nanotube growth

Examples

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Effect test

Embodiment 1

[0026] Such as figure 1 Shown, the method for anodizing a metal substrate in an anodizing reaction device comprises the following steps:

[0027] (1) Ultrasonic cleaning is performed on the nickel-containing metal substrate. In this embodiment, the nickel-containing metal substrate is pure nickel;

[0028] (2) Anodize the nickel-containing metal substrate, choose an acidic solution with a concentration of 0.001mol / l, use the nickel-containing metal substrate as the positive electrode, use a corrosion-resistant conductor (Pt) as the negative electrode, and apply a fixed voltage of 1V between the two electrodes , for 1 minute, chemical and ultrasonic cleaning of the nickel-containing metal substrate after anodizing;

Embodiment 2

[0030] Such as figure 1 Shown, the method for anodizing a metal substrate in an anodizing reaction device comprises the following steps:

[0031] (1) Ultrasonic cleaning is performed on the nickel-containing metal substrate. In this embodiment, the nickel-containing metal substrate is stainless steel.

[0032] Anodize the nickel-containing metal substrate, choose an acidic solution with a concentration of 0.1mol / l, use the nickel-containing metal substrate as the positive electrode, choose a corrosion-resistant conductor (Pt) as the negative electrode, and apply a fixed voltage of 10V between the two electrodes for 10 Minutes, chemical and ultrasonic cleaning of nickel-containing metal substrates after anodizing;

Embodiment 3

[0034] Such as figure 1 Shown, the method for anodizing a metal substrate in an anodizing reaction device comprises the following steps:

[0035] (1) Ultrasonic cleaning is performed on the nickel-containing metal substrate. In this embodiment, the nickel-containing metal substrate is Hastelloy;

[0036] (2) Anodize the nickel-containing metal substrate, choose an acidic solution with a concentration of 1mol / l, use the nickel-containing metal substrate as the positive electrode, choose a corrosion-resistant conductor (Pt) as the negative electrode, and apply a fixed voltage of 100V between the two electrodes. Lasting for 100 minutes, chemical and ultrasonic cleaning of the nickel-containing metal substrate after anodizing;

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Abstract

The invention discloses an anodization process for a metal substrate used for carbon nanotube growth. The metal substrate is a metal substrate containing a catalytic metal for carbon nanotube chemical vapor deposition reaction, and the catalytic metal is iron, cobalt or nickel The process steps include: the positive electrode of the DC power supply is connected to the metal substrate to form the anode, and other conductive substrates are used as the cathode, and both electrodes are immersed in the electrolyte to form a circuit. The electrolyte is a solution of acid, alkali, and salt. Form a dense, uniform porous structure. The process of the invention makes the natural points on the surface of the metal substrate suitable for the growth of carbon nanotubes uniform and increased, so that the metal substrate can provide catalytic particles of uniform nanoscale size at high temperature, and when it is applied to the growth of carbon nanotubes, the carbon nanotubes grow from The surface integrated with the metal substrate evenly grows on the catalyst metal particles, which effectively increases the bonding force, reduces the contact resistance and thermal resistance, and improves the electrical and thermal conductivity of the carbon tube.

Description

technical field [0001] The invention discloses a field of growing carbon nanotubes, in particular to a metal substrate anodization process for growing carbon nanotubes. Background technique [0002] Carbon nanotubes (CNTs) have typical layered hollow structure characteristics, high aspect ratio, high mechanical strength, and stable chemical properties, making them widely used in nanoelectronic components, sensor devices, field emission devices, and energy devices. Its application has received extensive attention and research. The preparation of high-quality CNTs with excellent physical, chemical, electrical and mechanical properties is the key to the application. [0003] At present, in the preparation of CNT thin film, chemical vapor deposition (CVD) in situ growth method is commonly used. The CVD method has the advantages of simple equipment, low cost, easy control of process parameters, and high yield, so it is widely used in the preparation of various CNT devices. Tra...

Claims

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Application Information

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IPC IPC(8): C25D11/02C23C16/02C23C16/26
Inventor 董长昆翟莹
Owner WENZHOU UNIVERSITY
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