Image enhancer

Abstract

The invention discloses an image enhancer which comprises an outer housing in a cylinder structure, wherein a top cap is arranged at the upper end of the outer housing; a bottom cap is arranged at the bottom end of the outer housing; the top cap and the bottom cap are mounted on the outer housing in a sealing manner; an input window is formed in the top cap; an optical fiber panel I is mounted on the input window in a sealing manner; an output window is formed in the bottom cap; an optical fiber panel II is mounted on the output window in a sealing manner; one side, close to an inner cavity of the outer housing, of the optical fiber panel II is coated with a fluorescent powder layer; the other side of the optical fiber panel II is covered with a lead glass layer; a microchannel plate is arranged in a position, above the output window, in the inner cavity of the outer housing; a photoelectric cathode is arranged on the microchannel plate; a plurality of supporting plates are arranged on an inner wall of the outer housing; and the microchannel plate is bonded on the supporting plates in a sealing manner. The enhancer is simple in structure, reasonable in design, convenient to mount, good in overall structure sealability, good in light path stability, stable and reliable in working performance, strong in practicability, good in use effect and high in popularization value and effectively avoids X-ray leakage.

Description

technical field [0001] The invention belongs to the field of image technology, and in particular relates to an image intensifier. Background technique [0002] With the rapid development of electronic science and technology, the miniaturization of packaging, the high density of assembly, and the continuous emergence of various new packaging technologies, strict requirements have been put forward for the quality inspection of surface mount technology (SMT) assembly products. Traditional manual visual inspection, automatic optical inspection (AOI), laser inspection, in-circuit testing (ICT) and other inspection technologies can no longer meet the requirements. [0003] The use of automatic X-ray inspection technology (AXI) has become the main method to solve the problem. It can not only detect hidden solder joints, such as BGA (Ball Grid Array Package), but also perform qualitative and quantitative analysis on the detection results, find electronic assembly failures in time, ...

AI Technical Summary

Problems solved by technology

[0005] The image intensifier in the X-ray detection system is an essential component. After the X-ray passes through the PCB board, the image intensifier is used to receive and intensify the image, and finally the image information on the image intensifier is extracted by the CCD camera and handed over to the computer for processing; The traditional image intensifier has the disadvantages of being bulky, difficult to install, and unstable in the optical path

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