Conducting photosensitive resin for 3D printing and preparation method thereof

A photosensitive resin and photosensitive technology, applied in the field of conductive photosensitive resin for 3D printing and its preparation, can solve the problems of poor mechanical properties and non-conductivity of photosensitive resin

Active Publication Date: 2015-06-03
BYD CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is to provide a conductive photosensitive resin for 3D printing in view of the p

Method used

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  • Conducting photosensitive resin for 3D printing and preparation method thereof

Examples

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Comparison scheme
Effect test

Embodiment 1

[0025] This example is used to illustrate the conductive photosensitive resin disclosed in the present invention and its preparation method.

[0026] Mix and stir 35 parts by weight of epoxy acrylate oligomer, 25 parts by weight of phenoxyethyl acrylate, and 15 parts by weight of trimethylolpropane triacrylate, then add 1 part by weight of benzoin dimethyl ether, 2 parts by weight Polyester-modified polydimethylsiloxane (BYK-307) and 17 parts by weight of carbon black (average particle size: 20nm) were heated and stirred in a water bath at 40°C to make them uniform.

[0027] Then vacuumize to remove air bubbles to obtain conductive photosensitive resin A1 with a viscosity of 300 mPa·s.

Embodiment 2

[0029] This example is used to illustrate the conductive photosensitive resin disclosed in the present invention and its preparation method.

[0030] Mix and stir 35 parts by weight of urethane acrylate oligomer, 30 parts by weight of phenoxyethyl acrylate, and 12 parts by weight of trimethylolpropane triacrylate, then add 1 part by weight of α-aminoketone photoinitiator, 2 parts by weight Parts of polyether-modified polydimethylsiloxane (BYK-310) and 20 parts by weight of silver powder (average particle size: 120nm), heated and stirred in a water bath at 50°C until uniform.

[0031]Then vacuumize to remove air bubbles to obtain conductive photosensitive resin A2 with a viscosity of 100 mPa·s.

Embodiment 3

[0033] This example is used to illustrate the conductive photosensitive resin disclosed in the present invention and its preparation method.

[0034] 30 parts by weight of epoxy acrylate oligomer, 15 parts by weight of phenoxyethyl acrylate, and 10 parts by weight of trimethylolpropane triacrylate are mixed and stirred, and then 1 part by weight of benzophenone photoinitiator, 4 parts by weight of polyether-modified polydimethylsiloxane (BYK-310) and 40 parts by weight of carbon black (with an average particle size of 20nm) were heated and stirred in a water bath at 30°C to make them uniform.

[0035] Then vacuumize to remove air bubbles to obtain conductive photosensitive resin A3 with a viscosity of 400 mPa·s.

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Abstract

In order to solve the problem of no conductivity and poor mechanical properties in the photosensitive resin for 3D printing in the prior art, the invention provides a conducting photosensitive resin for 3D printing, which comprises a photosensitive prepolymer, a monomer, a crosslinking agent, a photoinitiator, a surfactant conducting particles. On the basis of the total weight of the conducting photosensitive resin, the content of the photosensitive prepolymer is 30-60 wt%, the content of the monomer is 10-40 wt%, the content of the crosslinking agent is 10-30 wt%, the content of the photoinitiator is 1-5 wt%, the content of the organosilicon surfactant is 1-5 wt%, and the content of the conducting particles is 15-40 wt%. The monomer is phenoxyethyl acrylate, the crosslinking agent is trihydroxymethyl tripropane triacrylate, and the viscosity of the conducting photosensitive resin is 80-400 mPa.s. The invention also provides a preparation method of the conducting photosensitive resin. The conducting photosensitive resin provided by the invention is suitable for 3D printing equipment, and has excellent conductivity and mechanical properties after being cured.

Description

technical field [0001] The invention relates to a conductive photosensitive resin and a preparation method thereof, in particular to a conductive photosensitive resin for 3D printing and a preparation method thereof. Background technique [0002] Photosensitive resin material is a special resin with many advantages, generally composed of photosensitive prepolymer, reactive diluent and photosensitizer. Photosensitive resin materials can produce active fragments under the action of ultraviolet light, initiate polymerization and crosslinking reactions, and achieve curing in an instant. At present, photosensitive resin is widely used in laser rapid prototyping technology (RP). The basic principle is: the photosensitive resin is placed in a resin tank, and there is a computer-controlled platform in the resin tank that can be raised and lowered. The machining starts from the bottom, and laser scans according to the designed model. The photocurable resin undergoes cross-linking p...

Claims

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Application Information

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IPC IPC(8): C08F283/10C08F283/00C08F220/30C08F222/14C08F2/44C08K3/04C08K3/08
Inventor 李全省李金凤马桂英
Owner BYD CO LTD
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