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High-spatial-resolution and high-temporal-resolution infrared thermal imaging temperature measurement method

A high spatial resolution, infrared thermal imaging technology, applied in the field of temperature testing of semiconductor devices, can solve the problems of underestimating the peak temperature and failing to meet the high time resolution temperature detection at the same time, so as to improve the accuracy, increase the maximum temperature and ensure the accuracy Effect

Active Publication Date: 2015-06-17
THE 13TH RES INST OF CHINA ELECTRONICS TECH GRP CORP
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Problems solved by technology

Existing transient infrared equipment and microscopic infrared thermal imaging cameras cannot meet the temperature detection requirements of high time resolution and high spatial resolution at the same time
When measuring the temperature of tiny structures with high-speed temperature changes, the true peak temperature will inevitably be underestimated

Method used

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Embodiment Construction

[0036] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0037] Such as figure 1 As shown, a high spatial resolution and high time resolution infrared thermal imaging temperature measurement method includes the following steps:

[0038] (a) By adjusting the focus area of ​​the transient infrared device, use the transient infrared device to measure the temperature of the two regions of the tested object with significantly different temperatures. The region with significantly different temperatures refers to the temperature curve that should be able to clearly distinguish the two regions. The temperature in the area is generally not less than 10% of the maximum temperature, and two curves of temperature changing with time are obtained.

[0039] (b) Analyze the two temperature change curves to determine the time point when the DUT enters the quasi-steady state. Compare the two obtained temp...

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Abstract

The invention discloses a high-spatial-resolution and high-temporal-resolution infrared thermal imaging temperature measurement method and relates to the field of semiconductor device temperature testing. The method comprises the steps of 1, measuring the temperatures of two areas distinctly different in temperature of a unit under test by means of a transient infrared device by adjusting the focusing area of the transient infrared device, so that two curves indicating how temperature changes with time are obtained; 2, analyzing the two temperature change curves and judging the time point when the unit under test enters a quasi-stable state; 3, measuring the temperature of a target area by means of the transient infrared device, so that a temperature change curve of the target area is obtained; 4, measuring the temperature of the target area by means of an infrared microscopic thermographer, so that a temperature distribution image of the target area is obtained; 5, obtaining the accurate temperature value of any position of the target area at any moment; 6, obtaining a temperature distribution image of the whole area at any moment, or a temperature change curve of the whole time zone at any position. By the adoption of the method, high-spatial-resolution and high-temporal-resolution temperature measurement can be achieved.

Description

technical field [0001] The invention relates to the technical field of temperature testing of semiconductor devices. Background technique [0002] Existing infrared temperature measurement equipment is mainly divided into two categories: spot temperature measurement and imaging temperature measurement. Spot temperature measurement infrared devices often use a separate detector, such as a single photodiode or thermopile, which has a high response speed and sampling speed, and can meet the detection requirements for rapidly changing temperature signals, such as transient (transient) infrared devices . Imaging infrared equipment generally adopts an area array detector, such as an array detector composed of multiple photosensitive diodes, which can meet the imaging test of the device under test and has better detail resolution, that is, spatial resolution, such as microscopic Infrared thermal imager. [0003] Existing transient infrared temperature measuring equipment can det...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01J5/00
Inventor 翟玉卫刘岩郑世棋吴爱华乔玉娥梁法国
Owner THE 13TH RES INST OF CHINA ELECTRONICS TECH GRP CORP
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