Compound toughening bisphenol-A epoxy resin inserted-bar glue high in adhesive capability in high-temperature environment and preparation method of bispheonl-A epoxy resin inserted-bar glue
A technology of epoxy resin and high temperature environment, applied in the direction of epoxy resin glue, adhesive, adhesive type, etc., can solve the problem of poor bonding strength and use stability of epoxy glue, multifunctional bisphenol A epoxy resin and Poor compatibility of nitrile rubber and other problems, to achieve the effect of easy operation, excellent corrosion resistance and good bonding strength
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Embodiment 1
[0041] Component A: 40 parts of bisphenol A epoxy resin; 20 parts of carboxy-terminated butyronitrile modified bisphenol A epoxy resin; 15 parts of polyurethane modified bisphenol A epoxy resin; 2 parts of silane coupling agent. Component B: 15 parts of polyether amine; 10 parts of phenolic modified amine. A and B components are mixed and stirred evenly, and the adhesive is cured at room temperature for 24h+100°C / 3h to obtain the epoxy adhesive that can be used in a high temperature environment.
Embodiment 2
[0043] Component A: 50 parts of bisphenol A epoxy resin; 25 parts of carboxy-terminated butyronitrile modified bisphenol A epoxy resin; 25 parts of polyurethane modified bisphenol A epoxy resin; 3 parts of silane coupling agent. Component B: 20 parts of polyether amine; 15 parts of phenolic modified amine. A and B components are mixed and stirred evenly, and the adhesive is cured at 60°C / 2h+100°C / 3h to obtain the epoxy adhesive that can be used in a high temperature environment.
Embodiment 3
[0045] Component A: 55 parts of bisphenol A epoxy resin; 30 parts of carboxy-terminated butyronitrile modified bisphenol A epoxy resin; 30 parts of polyurethane modified bisphenol A epoxy resin; 3 parts of silane coupling agent. Component B: 25 parts of polyether amine; 20 parts of phenolic modified amine. A and B components are mixed and stirred evenly, and the adhesive is cured at room temperature for 12h+120°C / 3h to obtain the epoxy adhesive that can be used in a high temperature environment.
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