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A compound toughened bisphenol A epoxy resin planting glue with strong bonding ability in high temperature environment and preparation method

A technology of epoxy resin and high temperature environment, applied in the direction of epoxy resin glue, adhesive, adhesive type, etc., can solve the problem of poor bonding strength and use stability of epoxy glue, multifunctional bisphenol A epoxy resin and Poor compatibility of nitrile rubber and other problems, to achieve the effect of easy operation, excellent corrosion resistance and high bonding strength

Active Publication Date: 2017-11-07
DALIAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The present invention mainly solves the problem of poor bonding strength, poor service stability and multi-functionality of existing rubber and bisphenol A epoxy resin blend modification and common bisphenol A epoxy resin and reactive rubber reaction modified epoxy glue. The problem of poor compatibility of bisphenol A epoxy resin and nitrile rubber blending modification

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] Component A: 40 parts of bisphenol A epoxy resin; 20 parts of carboxy-terminated butyronitrile modified bisphenol A epoxy resin; 15 parts of polyurethane modified bisphenol A epoxy resin; 2 parts of silane coupling agent. Component B: 15 parts of polyether amine; 10 parts of phenolic modified amine. A and B components are mixed and stirred evenly, and the adhesive is cured at room temperature for 24h+100°C / 3h to obtain the epoxy adhesive that can be used in a high temperature environment.

Embodiment 2

[0041] Component A: 50 parts of bisphenol A epoxy resin; 25 parts of carboxy-terminated butyronitrile modified bisphenol A epoxy resin; 25 parts of polyurethane modified bisphenol A epoxy resin; 3 parts of silane coupling agent. Component B: 20 ​​parts of polyether amine; 15 parts of phenolic modified amine. A and B components are mixed and stirred evenly, and the adhesive is cured at 60°C / 2h+100°C / 3h to obtain the epoxy adhesive that can be used in a high temperature environment.

Embodiment 3

[0043] Component A: 55 parts of bisphenol A epoxy resin; 30 parts of carboxy-terminated butyronitrile modified bisphenol A epoxy resin; 30 parts of polyurethane modified bisphenol A epoxy resin; 3 parts of silane coupling agent. Component B: 25 parts of polyether amine; 20 parts of phenolic modified amine. A and B components are mixed and stirred evenly, and the adhesive is cured at room temperature for 12h+120°C / 3h to obtain the epoxy adhesive that can be used in a high temperature environment.

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PUM

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Abstract

The invention discloses compound toughening bisphenol-A epoxy resin inserted-bar glue high in adhesive capability in the high-temperature environment and a preparation method of the bispheonl-A epoxy resin inserted-bar glue. The compound toughening bisphenol-A epoxy resin inserted-bar glue is characterized by being made of raw materials comprising a component A and a component B, wherein the component A includes, by weight, 40-60 parts of bisphenol-A epoxy resin, 30-40 parts of end carboxyl nitrile modified bisphenol-A epoxy resin, 20-30 parts of polyurethane modified bisphenol-A epoxy resin and 3-5 parts of silane coupling agents, and the component B includes, by weight, 20-30 parts of polyether amine and 10-20 parts of phenolic aldehyde modified amine, and the component A and the component B are subjected to mixture construction after being evenly mixed according to the weight ratio of 3 to 1. The outstanding characteristic of the glue is that steel-steel tensile shear strength can be up to 38Mpa, so that embedding length-to-diameter ratio can be reduced during bar inserting. A-grade adhesive bonding effect can be achieved when reinforcing steel bars are embedded shallowly, use in the high temperature environment of 120 DEG C can be achieved, and the glue is applicable to the occasion that the reinforcing steel bars limited in embedding depth are still kept high in bonding strength.

Description

technical field [0001] The invention relates to a planting glue and a preparation method thereof, in particular to a preparation method of a planting glue suitable for high-temperature environments with high bonding capacity. Background technique [0002] As a structural adhesive, bisphenol A epoxy resin has the disadvantages of high brittleness, stretchability during curing, and large internal stress. Elastomers have long been used to toughen bisphenol A epoxy adhesives to improve their bonding ability and impact resistance. For example, using acrylic acid and polyurethane to modify bisphenol A epoxy resin, the above methods are mostly bisphenol A epoxy resin mixed with rubber, and the poor compatibility of this kind of toughening method may lead to phase separation. Another method is to react reactive rubber with bisphenol A epoxy resin to introduce rubber into the chain of bisphenol A epoxy resin to produce strong chemical crosslinks, which can not only improve compatibi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/00C08G59/14
Inventor 任延煜贺高红陈振新贺曼罗
Owner DALIAN UNIV OF TECH
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