Method for manufacturing micro heat pipe by reducing copper oxide powder

Abstract

The invention discloses a method for manufacturing a micro high-porosity sintered copper heat pipe by using millimeter, micron or nanometer copper oxide powder. The method is similar to that of a conventional sintered copper heat pipe; and the difference is that the method prepares the heat pipe with needed high-porosity sintered copper as a liquid absorbing wick by adding copper oxide powder or copper oxide powder containing particles of different sizes and carrying out the hydrogen reduction and the sintering treatment. The micro heat pipe is generally manufactured by directly sintering the copper powder; and the porosity of the sintered copper liquid absorbing wick is generally 40-50%. The obtained sintered copper porosity of the sintered copper heat pipe manufactured by using the millimeter, micron or nanometer copper oxide powder or the mixture thereof containing particles of different sizes reaches up to 60-80%; and the porosity can be designed as required. The method can increase the backflow speed of a liquid medium in the high-porosity sintered copper liquid absorbing wick, greatly reduce the heat resistance of the medium in the heat pipe in the liquid-steam phase change circulating process, and improve the radiating efficiency. The manufacturing method is simple, free of pollution in the production process, low in cost and suitable for industrial production.

Description

technical field [0001] The invention relates to a manufacturing method of a micro heat pipe for rapid heat dissipation of an electronic component, in particular to a method of manufacturing a micro heat pipe with high porosity sintered porous copper as a liquid-absorbing core by reducing copper oxide powder. Background technique [0002] Electronic thermal management is an important field in the semiconductor and electronics industry, because thermal management is to effectively control the operating temperature of semiconductor electronic equipment to ensure its stability and reliability. With the rapid development of microelectronic technologies such as IT, communication, LED and solar energy, the size of semiconductor electronic components has entered submicron and nanometer levels from the micron level. With the increasing integration of electronic devices, the high frequency and high speed of electronic devices and the high density and volume of integrated circuits tend...

AI Technical Summary

Problems solved by technology

[0007] For the sintered copper liquid-absorbing core heat pipes that are generally directly made of micron-sized copper powder, the porosity of the sintered copper powder is about 40-50%, the porosity is relatively low, and the reflux thermal resistance is relatively large during the cycle

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