Check patentability & draft patents in minutes with Patsnap Eureka AI!

A liquid-cooled and heat-dissipating LED optical module

A liquid-cooled heat dissipation, optical module technology, applied in the field of optical modules, can solve the problems of insufficient contact surface, reduced light efficiency, increased thermal resistance, etc., and achieves direct and direct heat dissipation channels, wide heat dissipation channels, and good thermal conductivity. Effect

Active Publication Date: 2018-08-21
SICHUAN SUNFOR LIGHT
View PDF11 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] 1. Since the LED is a directional light source, an effective light pattern conversion method is required to convert the small-angle light into an omnidirectional light. However, according to the usual practice, one way is to use a lens to convert the light angle, but it involves The light output efficiency is reduced and the cost is increased; another method is to change the planar arrangement of the LED lamp beads to a three-dimensional multi-directional arrangement, but the heat dissipation path is reduced and the thermal resistance is increased, the heat dissipation effect is deteriorated, and the light efficiency is reduced;
[0009] 2. The COB light source emits a lot of heat, which must be solved through good heat conduction. The heat conduction path should be as smooth as possible. According to the traditional method, after five or six layers of medium are transferred layer by layer, each layer has a large Thermal resistance, not to mention the insufficient contact surface caused by processing and assembly, resulting in huge air thermal resistance, how to most effectively export the heat generated by the LED light-emitting part, only direct contact with the light-emitting part can do this

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A liquid-cooled and heat-dissipating LED optical module
  • A liquid-cooled and heat-dissipating LED optical module
  • A liquid-cooled and heat-dissipating LED optical module

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0028] image 3 A liquid-cooled and heat-dissipating LED light module according to an embodiment of the present invention is schematically shown in a front view. according to image 3 It can be seen that the LED light module includes a light emitting cover 4 and a heat sink 2 . The heat sink has a plurality of cooling fins 201 . see Figure 5 , these cooling fins have the same axial length but different radial lengths, and these cooling fins 201 are arranged in parallel in the axial direction; at the same time Figure 5 A usage posture of the LED light module of the present invention is shown. Figure 4 It can be seen that the general appearance shape of the LED light module of the present invention is generally a rod-shaped body with a hemispherical end.

[0029] see below figure 1 and figure 2 The liquid-cooled and heat-dissipating LED optical module of the present invention is described in detail.

[0030] figure 1 An exploded view schematically shows a liquid-coo...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a liquid-cooled and heat-dissipating LED optical module (100), which comprises a circuit board installation part (1) and a radiator (2) arranged at the lower end of the circuit board installation part. The circuit board installation part (1) has a hollow hemispherical structure, which defines a hemispherical cavity (103), and the outer surface of the spherical wall of the circuit board installation part (1) is fixed with a flexible circuit board (3). ), a plurality of LED lamp beads (301) are distributed on it, and a light outlet cover (4) is sleeved on the periphery of the flexible circuit board and fixed to the circuit mounting part (1) and / or the radiator (2) in a liquid-tight manner, so that the A cavity (104) is formed between the light emitting cover (4) and the circuit board mounting part (1), and the cavity and the hemispherical cavity (103) pass through multiple The through holes (102) communicate with each other, and the cavity (104) and the hemispherical cavity (103) are filled with cooling liquid (5).

Description

technical field [0001] The present invention relates to the optical module technology in the field of LED lighting, in particular to an LED optical module, in particular to a liquid-cooled and heat-dissipating LED optical module. Background technique [0002] Under the current common practice of LED heat dissipation, the heat conduction path can be explained as follows: LED heat sink - thermal grease - copper foil as large as the heat sink - aluminum substrate insulation layer - aluminum plate - heat sink. It can be seen that the heat conduction path from the LED to the aluminum substrate is only the same size as the heat sink of the LED. For high-power LEDs, it is not enough to dissipate heat in this way, but how to dissipate heat can take into account miniaturization, high power, and low cost, which is an unresolved problem. [0003] In this regard, Chinese patent application publication CN201010247353.3 discloses a liquid-cooled LED lamp with a double-layer lampshade, wh...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): F21V29/56F21V23/00F21V3/06F21Y115/10
CPCF21S2/005F21V23/005
Inventor 高海生李刚唐超郑继均
Owner SICHUAN SUNFOR LIGHT
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More