LED (light-emitting diode) lamp filament

A technology of LED filaments and LED chips, which is applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems affecting the light efficiency and life of LED filaments, and the heat of LED chips cannot be quickly dissipated, so as to improve the light output angle and light output efficiency. Production The effect of high efficiency and yield rate, simple process

Inactive Publication Date: 2015-07-29
江西合晶科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, because glass is a poor conductor of heat, it cannot effectively dissipate the heat generate

Method used

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  • LED (light-emitting diode) lamp filament
  • LED (light-emitting diode) lamp filament
  • LED (light-emitting diode) lamp filament

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0036] Example 1

[0037] Such as figure 1 As shown, this embodiment provides an LED filament, which has a slender strip structure, the length of the filament is 30 mm, the width is 3 mm, and the height is 2.5 mm. The filament includes a bottom plate 1, a cover plate 3, an LED chip 2, an adhesive 5, and an electrode 6. The bottom plate 1 and the cover plate 3 are polycarbonate (PC) boards, and the PC board is mixed with 9% yellow phosphor. The chip 2 is fixed on the bottom plate 1, and the chip 2 is connected in series through the metal lead 4 and connected to the electrode 6. The bottom plate 1 and the cover plate 3 are joined together by an adhesive 5. The adhesive 5 is epoxy resin, and the adhesive 5 is mixed with 9% yellow phosphor.

Example Embodiment

[0038] Example 2

[0039] Such as figure 2 As shown, this embodiment provides an LED filament. The filament has a slender strip structure. The length of the filament is 20 mm, the width is 2 mm, and the height is 2 mm. The filament includes a bottom plate 1, a cover plate 3, an LED chip 2, an adhesive 5, and an electrode 6. The bottom plate 1 and the cover plate 3 are PC boards, and the PC board is mixed with 8% by mass yellow phosphor and 2% by mass red phosphor, and also mixed with aluminum nitride powder as a heat dissipation material. The chip 2 is fixed on the bottom plate 1, and the chip 2 is connected in series through the metal lead 4 and connected to the electrode 6. The bottom plate 1 and the cover plate 3 are joined together by an adhesive 5. The adhesive 5 is silica gel, and the adhesive 5 is mixed with 8% by mass yellow phosphor and 2% by mass red phosphor. At the same time, it is mixed with aluminum nitride powder as a heat dissipation material. The mass content...

Example Embodiment

[0040] Example 3

[0041] Such as image 3 As shown, this embodiment provides an LED filament. The filament includes a bottom plate 1, a cover plate 3, an LED chip 2, an adhesive 5, and an electrode 6. The bottom plate 1 and the cover plate 3 are polytetrafluoroethylene plates, and the polytetrafluoroethylene plates are mixed with 9% yellow phosphor powder and diamond powder as a heat dissipation material. The chip 2 is fixed on the bottom plate 1, and the chip 2 is connected in series through the metal lead 4 and connected to the electrode 6. The bottom plate 1 and the cover plate 3 are joined together by an adhesive 5. The adhesive 5 is epoxy resin, and the adhesive 5 is mixed with 9% yellow phosphor powder, and at the same time is mixed with diamond powder as a heat dissipation material, wherein the mass percentage of the diamond powder is 1%. A transparent inner surface heat dissipation layer 7 is sputtered on the upper surface of the base plate 1 and the lower surface of t...

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Abstract

The invention provides an LED (light-emitting diode) lamp filament which comprises a bottom plate, a cover plate, LED chips and an electrode, wherein the LED chips are positioned between the bottom plate and the cover plate, fixed onto the bottom plate, connected in a routing manner and connected with the electrode, and the bottom plate and the cover plate are combined together through an adhesive and are organic transparent plates doped with fluorescent powder. The LED lamp filament has the advantages of peripheral light emission, high light intensity, fine heat diffusivity, long service life, low cost and the like.

Description

technical field [0001] The invention relates to the technical field of LED lighting, in particular to an LED filament. Background technique [0002] The filaments of traditional lighting fixtures are generally composed of tungsten wires and other metal wires that can directly emit light. Such filaments generally have defects such as short life, high power consumption, and poor heat dissipation. Generally, they can only emit yellow light and have poor color rendering. [0003] LED is a light-emitting diode (LED, Lighting emitted diode), which is a solid-state light-emitting device that uses the PN junction to emit light under the action of an electric field. It has the characteristics of long life, environmental protection, and energy saving. It is a new green light source. With the development of science and technology, LED lights are gradually replacing traditional lighting fixtures. LED technology is becoming more and more mature. At present, LED white light is white ligh...

Claims

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Application Information

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IPC IPC(8): H01L25/075H01L33/48H01L33/50
CPCH01L2224/48091H01L2224/48137H01L2924/00014
Inventor 章少华谢冰易志华
Owner 江西合晶科技有限公司
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