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Heat-curable coloring composition, cured film, touch panel provided with said cured film, and method for producing touch panel using said heat-curable coloring composition

A coloring composition, thermosetting technology, applied in semiconductor/solid-state device manufacturing, data processing input/output process, instruments, etc., can solve the problem of low heat resistance of light-shielding patterns, complicated manufacturing processes, and reduced performance of touch panels, etc. problems, achieve excellent chemical resistance and excellent heat resistance

Active Publication Date: 2015-08-05
TORAY IND INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the heat resistance of the light-shielding pattern is low, the film formation temperature of ITO cannot be increased, and the performance of the touch panel decreases
When the chemical resistance of the light-shielding pattern is low, it is necessary to further perform SiO on the light-shielding pattern 2 The film formation of the film, etc., the manufacturing process is complicated

Method used

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  • Heat-curable coloring composition, cured film, touch panel provided with said cured film, and method for producing touch panel using said heat-curable coloring composition
  • Heat-curable coloring composition, cured film, touch panel provided with said cured film, and method for producing touch panel using said heat-curable coloring composition
  • Heat-curable coloring composition, cured film, touch panel provided with said cured film, and method for producing touch panel using said heat-curable coloring composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0079] Examples and comparative examples are given below to further describe the present invention in detail. The evaluation methods in each Example and Comparative Example are as follows.

[0080]

[0081] On a 10 cm square glass substrate, apply thermosetting coloring with a spin coater (1H-360S, manufactured by Mikasa Co., Ltd.) so that the film thickness after curing is 10 μm, 15 μm, 20 μm, 25 μm, and 30 μm. The composition was cured at 250° C. for 60 minutes, and then the presence or absence of cracks was visually checked. Regardless of the number of cracks, even if one crack occurs, it is judged that the film thickness does not have crack resistance. For example, when there are no cracks at 15 μm but cracks occur at 20 μm, the crack-resistant film thickness is judged to be “15-20 μm”. The crack-resistant film thickness when there were no cracks at 30 μm was judged as “>30 μm”, and the crack-resistant film thickness when cracks were found even at 10 μm was judged as “<1...

Synthetic example 1

[0105] (Synthesis Example 1) Synthesis of Silicone Resin Solution (b-1)

[0106] 122.18 g of diphenyldimethoxysilane (DiPh-DiMS, 0.5 mol), 74.10 g of vinyltrimethoxysilane (Vinyl-TMS, 0.5 mol), and 37.37 g of ethyl acetoacetate were added to a 500 mL three-necked flask . While stirring the solution at room temperature, an aqueous phosphoric acid solution in which 1.0 g of phosphoric acid was dissolved in 54.0 g of water was added over 30 minutes. Then the flask was immersed in a 40°C oil bath, stirred for 30 minutes, then the oil bath was set at 80°C, heated for 30 minutes, and the temperature of the oil bath was further raised to 120°C. The reaction was terminated 3 hours after the start of temperature rise. At this time, the internal temperature of the solution rose to a temperature about 5° C. lower than the setting of the oil bath. Methanol formed in the reaction and unconsumed water were removed by distillation. Ethyl acetoacetate was added to the ethyl acetoacetate s...

Synthetic example 2

[0107] (Synthesis Example 2) Synthesis of Silicone Resin Solution (b-2)

[0108] The materials initially added to the three-necked flask were set to 122.18 g diphenyldimethoxysilane (0.5 mole), 44.46 g vinyltrimethoxysilane (0.3 mole), 39.66 g phenyltrimethoxysilane (Ph -TMS, 0.2 mol) and 42.08 g of ethyl acetoacetate were carried out in the same manner as in Synthesis Example 1 to obtain a silicone resin solution (b-2).

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Abstract

The objective of the present invention is to provide a heat-curable coloring composition having superior chemical resistance while having high heat resistance, and that is such that cissing problems do not arise even if a common light-sensitive transparent material or the like is applied to a formed cured film. The heat-curable coloring composition contains: (A) an inorganic pigment or a phthalocyanine pigment, (B) a polysiloxane obtained from the co-hydrolysis-condensation of alkoxy silane compounds including a specific range of compounds, and (C) an organic solvent.

Description

technical field [0001] The present invention relates to a thermosetting coloring composition, a cured film, a touch panel including the cured film, and a method for producing a touch panel using the thermosetting coloring composition. Background technique [0002] In recent years, mobile devices using projected capacitive touch panels, such as smartphones and tablet PCs, have spread rapidly. In a projected capacitive touch panel, generally, an ITO (indium tin oxide) film is patterned in a screen area, and a metal wiring portion such as molybdenum is further formed in a peripheral portion thereof. In order to hide such a metal wiring portion, a light-shielding pattern such as black or white is often formed inside a cover glass of a projected capacitive touch panel. [0003] The methods of touch panels are roughly divided into: Out-sell type in which the touch panel layer is formed between the cover glass and the liquid crystal panel, On-sell type in which the touch panel lay...

Claims

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Application Information

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IPC IPC(8): C08L83/07C08K3/22C08K5/3415H01L21/027
CPCG06F2203/04103C08K3/22C08K5/3415G06F3/044C08K5/0041C08K5/0091C08K2003/2241C08L83/04
Inventor 冈泽彻诹访充史井上欣彦
Owner TORAY IND INC
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