Heat-curable coloring composition, cured film, touch panel provided with said cured film, and method for producing touch panel using said heat-curable coloring composition
A coloring composition, thermosetting technology, applied in semiconductor/solid-state device manufacturing, data processing input/output process, instruments, etc., can solve the problem of low heat resistance of light-shielding patterns, complicated manufacturing processes, and reduced performance of touch panels, etc. problems, achieve excellent chemical resistance and excellent heat resistance
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[0078] Example
[0079] Examples and comparative examples are given below to further illustrate the present invention in detail. The evaluation method in each example and comparative example is as follows.
[0080]
[0081] A spin coater (1H-360S, manufactured by Mikaso Co., Ltd.) was used to apply thermosetting coloring to a glass substrate of 10 cm square so that the cured film thickness was 10 μm, 15 μm, 20 μm, 25 μm and 30 μm. The composition was cured at 250°C for 60 minutes, and then it was visually confirmed whether cracks occurred. Regardless of the number of cracks, even if one crack occurs, it is judged that the film thickness does not have crack resistance. For example, when there is no crack at 15 μm and there is a crack at 20 μm, the crack-resistant film thickness is judged as "15-20 μm". The thickness of the anti-crack film when there is no crack at 30μm is judged as "> 30μm", the thickness of the anti-crack film when there are cracks at 10μm is judged as <10μm".
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Example Embodiment
[0105] (Synthesis example 1) Synthesis of siloxane resin solution (b-1)
[0106] 122.18g of diphenyldimethoxysilane (DiPh-DiMS, 0.5mol), 74.10g of vinyltrimethoxysilane (Vinyl-TMS, 0.5mol) and 37.37g of ethyl acetoacetate were added to a 500mL three-necked flask . While stirring the solution at room temperature, an aqueous phosphoric acid solution in which 1.0 g of phosphoric acid was dissolved in 54.0 g of water was added over 30 minutes. Then the flask was immersed in an oil bath at 40°C, stirred for 30 minutes, and then the oil bath was set to 80°C, heated for 30 minutes, and the oil bath was further heated to 120°C. The reaction was terminated 3 hours after the start of the temperature rise. At this time, the internal temperature of the solution rises to a temperature about 5°C lower than the setting of the oil bath. The methanol produced in the reaction and the unconsumed water are removed by distillation. Ethyl acetoacetate was added to the obtained polysiloxane ethyl a...
Example Embodiment
[0107] (Synthesis example 2) Synthesis of siloxane resin solution (b-2)
[0108] The materials initially added to the three-necked flask were 122.18g diphenyldimethoxysilane (0.5mol), 44.46g vinyltrimethoxysilane (0.3mol), 39.66g phenyltrimethoxysilane (Ph -TMS, 0.2 mol) and 42.08 g of ethyl acetoacetate, except that it was the same as Synthesis Example 1, to obtain a siloxane resin solution (b-2).
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