Intelligent power module and manufacturing method thereof

Abstract

The present invention discloses an intelligent power module and a method for manufacturing the same. The intelligent power module comprises circuit wirings, power elements and non-power elements which are arranged at the predetermined positions of the circuit wirings, and a paper radiator as a carrier. One side of the radiator is used as the right side to be covered with an insulating layer, the circuit wirings are arranged on the insulating layer to be far away from the side of the radiator, and the other side of the radiator is used as a backside. Folds used for radiating heat are arranged at the positions corresponding to the power elements, and partitions are arranged on the backside of the radiator. According to the present invention, the heat radiation effect, the electric performance and the heat stability of the intelligent power module are improved, and the cost is reduced.

Description

technical field [0001] The invention relates to the technical field of intelligent power modules, in particular to an intelligent power module packaged in the form of a transfer mold for specific application occasions such as frequency conversion air conditioners and a manufacturing method thereof. Background technique [0002] Intelligent Power Module (IPM, Intelligent Power Module) is a power drive product that combines power electronics and integrated circuit technology. The intelligent power module integrates the power switching device and the high-voltage driving circuit, and has built-in fault detection circuits such as overvoltage, overcurrent and overheating. On the one hand, the intelligent power module receives the control signal from the MCU to drive the subsequent circuit to work, and on the other hand, it sends the system status detection signal back to the MCU. Intelligent power modules win more and more markets with their advantages of high integration and hi...

AI Technical Summary

Problems solved by technology

[0005] Since the smart power module 100 generally works in a high-temperature environment, and the power element 109 emits a large amount of heat during operation, the junction temperature of the power element 109 is very high. , resulting in a higher overall thermal resistance of the intelligent power module 100

Moreover, due to the heat conduction of the circuit substrate 106, the heat of the power element 109 is transferred to other devices, causing non-negligible temperature drift in the electrical parameters of other devices.

[0006] Therefore, the existing intelligent power module works at high temperature for a long time, which will seriously reduce its service life and affect the stability of performance. In extreme cases, it will cause the intelligent power module to explode out of control due to overheating of internal components during operation. , causing casualties and property damage

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