Impurities diffusion layer forming composition, n-type diffusion layer forming composition, method for manufacturing n-type diffusion layer, p-type diffusion layer forming composition, method for manufacturing p-type diffusion layer, and method for manufacturing solar cell elements
A technology of impurity diffusion and composition, which is applied in the direction of electrical components, semiconductor/solid-state device manufacturing, and final product manufacturing. Effect
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Embodiment 1A
[0169] Using an automatic mortar mixing device, the P 2 o 5 -ZnO-based glass (P 2 o 5 : 30%, ZnO: 70%) powder 20g, ethyl cellulose 0.08g, and 2-(2-butoxyethoxy)ethyl acetate 2.14g were mixed to make a paste to prepare a glass with a content rate of 90% n-type diffusion layer forming composition.
[0170] Next, the prepared paste was applied on the surface of the p-type silicon substrate by screen printing, and dried on a hot plate at 150° C. for 5 minutes. Next, thermal diffusion treatment was performed in an electric furnace set at 1000° C. for 10 minutes, and then, to remove the glass layer, the substrate was immersed in 2.5% hydrofluoric acid for 90 minutes and washed with running water. Then, drying is performed.
[0171] The sheet resistance of the surface on which the n-type diffused layer-forming composition was applied was 11Ω / □, and P (phosphorus) diffused to form an n-type diffused layer. Since the sheet resistance of the back surface was 1,000,000Ω / □ or more, ...
Embodiment 2A
[0174] Using an automatic mortar mixing device, the P 2 o 5 -ZnO-based glass (P 2 o 5 : 30%, ZnO: 70%) powder 8g, ethyl cellulose 0.17g and 2-(2-butoxyethoxy) ethyl acetate 4.27g were mixed to make a paste to prepare a glass with a content rate of 65%. % n-type diffusion layer forming composition.
[0175] Next, the prepared paste was applied on the surface of the p-type silicon substrate by screen printing, and dried on a hot plate at 150° C. for 5 minutes. Next, thermal diffusion treatment was performed for 10 minutes in an electric furnace set at 1000° C., and then, in order to remove the glass layer, the substrate was immersed in 2.5% hydrofluoric acid for 40 minutes and washed with running water. Then, drying is performed.
[0176] The sheet resistance of the surface on which the n-type diffused layer-forming composition was applied was 12 Ω / □, and P (phosphorus) diffused to form an n-type diffused layer. Since the sheet resistance of the back surface was 1,000,000Ω...
Embodiment 3A
[0178] Using an automatic mortar mixing device, the P 2 o 5 -ZnO-based glass (P 2 o 5 : 30%, ZnO: 70%) powder 6g, ethyl cellulose 0.91g, and 2-(2-butoxyethoxy) ethyl acetate 23.1g were mixed to make a paste, thereby preparing the glass content ratio 20% of n-type diffusion layer forming composition.
[0179] Next, the prepared paste was applied on the surface of the p-type silicon substrate by screen printing, and dried on a hot plate at 150° C. for 5 minutes. Next, thermal diffusion treatment was performed for 10 minutes in an electric furnace set at 1000° C., and then, to remove the glass layer, the substrate was immersed in 2.5% hydrofluoric acid for 30 minutes and washed with running water. Then, drying is performed.
[0180] The sheet resistance of the surface on which the n-type diffusion layer-forming composition was applied was 11Ω / □. P (phosphorus) diffuses to form an n-type diffusion layer. Since the sheet resistance of the back surface was 1,000,000Ω / □ or mor...
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