Conductive surfacing material for composite structures

A surface material and composite structure technology, applied in conductive materials dispersed in non-conductive inorganic materials, thin material treatment, epoxy resin coatings, etc. And other issues

Active Publication Date: 2015-08-19
CYTEC IND INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it is undesirable to incorporate conductive materials that would add significantly to the overall weight of the aircraft
Furthermore, conventional surface films are very intolerant to commercial p

Method used

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  • Conductive surfacing material for composite structures
  • Conductive surfacing material for composite structures
  • Conductive surfacing material for composite structures

Examples

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example

[0064] The following examples present specific examples of conductive surface materials according to the invention and are not intended to limit the scope of the invention in any way.

[0065] Nine resin films were prepared based on the formulations (1 to 9) shown in Table 2. All amounts are in percent by weight.

[0066] Table 2

[0067]

[0068]

[0069] Each resin film was prepared by adding the components disclosed in Table 2 to a mixing vessel and mixing the components using a laboratory high shear mixer. Add the epoxy first. When necessary, MEK is added as a solvent to the epoxy resin mixture to adjust the rheology and solids content of the composition. Subsequently, a toughening agent (pre-reacted adduct and / or PES-PEES copolymer) is added to the epoxy resin. In some surface films (Recipes 4 to 7), a conductive additive (silver flakes or Ag-Cu flakes) was also added to the mixing vessel. Additionally, ceramic microspheres, fumed silica, and UV stabilizers (in...

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Abstract

An electrically conductive surfacing material capable of providing sufficient conductivity for lightning strike protection (LSP) and/or electromagnetic interference (EMI) shielding is disclosed. The conductive surfacing material is a multi-layered structure having a very thin conductive layer (e.g. solid metal foil) and a resin film formed on at least one surface of the conductive layer. The resin film is formed from a curable resin composition containing an epoxy novolac resin, a tri-functional or tetra-functional epoxy resin, ceramic microspheres, a latent amine-based curing agent, particulate inorganic fillers; and a toughening component. Optionally, the resin film further includes conductive additives to increase electrical conductivity of the surfacing material. The resin film exhibits high Tg as well as high resistance to paint stripper solutions. Furthermore, the conductive surfacing material is suitable for co-curing with fiber-reinforced resin composite substrates.

Description

Background technique [0001] Fiber-reinforced polymer matrix composites (PMCs) are high-performance structural materials commonly used in applications requiring resistance to aggressive environments, high strength, and / or low weight. Examples of these applications include aircraft components (such as tails, wings, fuselages, and propellers), high-performance automobiles, boat hulls, and bicycle frames. [0002] Composite structural components for aerospace applications often include surface films to provide the composite structure with the desired performance characteristics prior to painting. The surface film is used to improve the surface quality of structural components while reducing labor, time and cost. The surface film is typically co-cured with the fiber reinforced polymer matrix composite during the manufacture of the structural component. Conventional epoxy-based composite prepregs and surface films exhibit poor resistance to electromagnetic energy (EME) events such...

Claims

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Application Information

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IPC IPC(8): B32B5/00C08J5/24H01B1/22
CPCY10T156/1002H02G13/80H05K9/0084C08J5/24Y10T428/249974C09D163/00Y10T428/252B32B5/00B32B5/022B32B5/12B32B5/26B32B15/14B32B15/20B32B2260/021B32B2260/023B32B2260/046B32B2264/105B32B2264/107B32B2264/108B32B2307/202B32B2307/536B32B2605/08B32B2605/12B32B2605/18C08G59/38C08L63/00C08L2205/02C08K7/18C08J5/243C08J5/249Y02T50/40B32B15/092H01B1/22C08L63/04B32B37/14B32B2305/076
Inventor 均吉·杰弗瑞·桑达利夫·库玛·柯里
Owner CYTEC IND INC
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