Low density heat conduction pouring sealant and preparation method thereof

Abstract

The invention discloses a low density heat conduction pouring sealant which comprises 100 parts of vinyl silicone oil, 2-20 parts of cross-linking agent, 0.01-0.4 parts of catalyst, 50-300 parts of heat conduction filler, 0-15 parts of reinforcing filler, 10-60 parts of inflaming retarding filler, 5-90 parts of low density filler and 0.001-0.05 part of inhibitor. The sealant has good heat conduction performance, excellent inflaming retarding performance and dynamic performance and low density. Compared with common heat conduction pouring sealant, the sealant achieves the effect that the density is reduced by about 40%, and has wide application prospect in the field of electronic devices, electric automobiles and the like. A preparation method of the low density heat conduction pouring sealant is further provided. The method includes three steps of base material preparation, preparation of a component A and a component B and preparation of the low-density heat conduction pouring sealant. The preparation method is simple in process, short in production period, low in workload and very suitable for industrial large-scale production. The equipment is conventional equipment.

Description

technical field [0001] The invention relates to a low-density heat-conducting potting glue and a preparation method thereof, belonging to the technical field of potting glue. Background technique [0002] Addition-type liquid silicone rubber has the characteristics of no by-product release during cross-linking, small linear shrinkage, easy control of cross-linking density and vulcanization speed, and excellent high and low temperature resistance, weather resistance, electrical insulation, etc., so it is widely used in electronic appliances potting and other fields. With the development of the electronics industry, high-tech technologies such as electronic components, large integrated circuit boards, and LEDs tend to be more intensive and miniaturized, and the requirements for light weight, high thermal conductivity, and high elasticity are becoming more and more stringent. Therefore, the demand for new thermally conductive potting compounds is also increasing year by year. ...

AI Technical Summary

Problems solved by technology

However, with the use of a large number of functional fillers such as thermal conductivity and flame retardancy, although the flame retardancy and heat dissipation functions of automobile batteries can be well realized, the battery weight of electric vehicles has increased significantly, which significantly limits its wide application in electric vehicles. application

[0005] At present, there is no heat-conducting potting compound product specifically aimed at reducing density in the domestic market.

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