Unlock instant, AI-driven research and patent intelligence for your innovation.

Display panel, packaging method thereof, and display device

A technology for display panels and encapsulation adhesives, used in diodes, organic semiconductor devices, semiconductor devices, etc., can solve the problems of mechanical peeling, affecting mechanical bonding force, low interface bonding force, etc., to ensure packaging strength, avoid stress problems, Improve the effect of mechanical bonding

Active Publication Date: 2019-06-04
BOE TECH GRP CO LTD
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, when using the laser beam to heat the glass glue, it cannot ensure that the glass glue in each area is fully heated, and the glass glue in the insufficiently heated area may not melt, which affects the mechanical relationship between the upper and lower substrates. Bonding force; at the same time, the packaged glass glue is in direct contact with the substrate. Due to the stress problem caused by the mismatch between the thermal expansion coefficient of the glass glue and the substrate, the interface bonding force between the glass glue and the substrate is different from that of other packaging glue materials (such as UV glue). ) is lower than
To sum up, the existing mechanical bonding force between the two substrates encapsulated by glass glue is weak, and mechanical peeling is prone to occur.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Display panel, packaging method thereof, and display device
  • Display panel, packaging method thereof, and display device
  • Display panel, packaging method thereof, and display device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] This embodiment provides a display panel, including a first substrate and a second substrate arranged in a box, an encapsulation adhesive layer is arranged between the first substrate and the second substrate, and the first substrate and the second substrate are bonded by the encapsulation adhesive layer. Connected together, the first substrate is provided with a first thermal conduction pattern in contact with the encapsulation adhesive layer at a position corresponding to the encapsulation adhesive layer. generated heat.

[0044] In this embodiment, the position of the first substrate corresponding to the encapsulation adhesive layer is provided with a first heat conduction pattern that is in contact with the encapsulation adhesive layer. The encapsulation adhesive layer of the second substrate conducts the heat generated by the laser, so that when the encapsulation adhesive is heated by the laser, the heat can be conducted, and the encapsulation adhesive is fully hea...

Embodiment 2

[0056] An embodiment of the present invention also provides a display device, including the above-mentioned display panel. The display device can be any product or component with a display function such as a liquid crystal panel, a liquid crystal TV, a liquid crystal display, a digital photo frame, a mobile phone, a tablet computer, a navigator, and an electronic paper.

Embodiment 3

[0058] This embodiment provides a packaging method for a display panel, including:

[0059] forming a first heat conduction pattern on the first substrate corresponding to the bonding position of the encapsulation glue;

[0060] Coating encapsulation glue on the first substrate, the encapsulation glue is in contact with the first heat conduction pattern;

[0061] The encapsulation glue is irradiated with laser, and the encapsulation glue is heated to bond the first substrate and the second substrate with the melted encapsulation glue. During the laser irradiation process, the first heat conduction pattern can conduct the heat generated by the laser.

[0062] In this embodiment, the position of the first substrate corresponding to the encapsulation adhesive layer is formed with a first heat conduction pattern in contact with the encapsulation adhesive layer, and the first heat conduction pattern can be used to heat the encapsulation adhesive with a laser to form a bond between ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a display panel, a packaging method thereof, and a display device, which belong to the field of display technology. The display panel of the present invention includes a first substrate and a second substrate arranged opposite to the box, a packaging adhesive layer is provided between the first substrate and the second substrate, and the first substrate and the second substrate are packaged The adhesive layers are bonded together, wherein the position of the first substrate corresponding to the encapsulation adhesive layer is provided with a first heat conduction pattern in contact with the encapsulation adhesive layer, and the first heat conduction pattern can When the encapsulation glue is heated to form the encapsulation glue layer, the heat generated by the laser is conducted. The technical solution of the invention can improve the mechanical bonding force between the encapsulation glue and the substrate, improve the mechanical strength of the encapsulation, and prolong the life of the display device.

Description

technical field [0001] The present invention relates to the field of display technology, in particular to a display panel, a packaging method thereof, and a display device. Background technique [0002] In recent years, organic light-emitting diode (OLED) devices have gradually received more attention as a new type of flat panel display. Due to its active light emission, high luminous brightness, high resolution, wide viewing angle, fast response speed, low energy consumption, and flexibility, it has become a next-generation display technology that may replace liquid crystal display. However, since there are organic layer materials that are extremely sensitive to water vapor and oxygen in the OLED device, the lifetime of the OLED device is greatly reduced. At present, in order to solve this problem, the method adopted is to encapsulate the OLED array substrate by using the encapsulation substrate, so as to isolate the organic layer material from the external space. [0003...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L27/32H01L51/52H01L51/56
CPCH10K59/122H10K59/8722H10K59/12H10K59/8794H10K50/87H10K50/8426H10K59/38H10K71/00H10K2102/103
Inventor 王丹刘利宾
Owner BOE TECH GRP CO LTD