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Hot-melt type curable silicone composition for compression molding or laminating

A technology of compression molding and silicone, applied in the direction of coating, application, layered products, etc., can solve the problems of difficult to obtain hemispherical lens or dome-shaped sealing body, difficult to control the shape of the sealing body, etc.

Active Publication Date: 2015-08-26
DOW SILICONES CORP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Therefore, it is difficult to control the shape of the sealing body
[0006] Japanese Unexamined Patent Application Publication No. 2007-123915A discloses the use of phosphor sheets containing phosphor-containing silicone for laminating LEDs, but does not use heat-fusible hydrosilylation-crosslinkable silicone Composition, and it is difficult to obtain a hemispherical lens or a dome-shaped seal

Method used

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  • Hot-melt type curable silicone composition for compression molding or laminating
  • Hot-melt type curable silicone composition for compression molding or laminating
  • Hot-melt type curable silicone composition for compression molding or laminating

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example

[0321] Hereinafter, the present invention will be described using examples, but the present invention is not limited thereto.

[0322] [Practical example 1]

[0323] Add 75 parts by mass by average unit formula (MeViSiO 2 / 2 ) 0.25 (Ph 2 SiO 2 / 2 ) 0.3 (PhSiO 3 / 2 ) 0.45 Represented methyl vinyl polysiloxane, 25 parts by mass by formula (HMe 2 SiO) 2 SiPh 2 Represented trisiloxane, 10 parts by mass by ViMe 2 SiO(MePhSiO) 17.5 SiViMe 2 Represented by methylphenylpolysiloxane, platinum-1,3-divinyl-1,1,3,3-methyldisiloxane, 1,3-divinyl-1,1,3, 3-Tetramethyldisiloxane solution (in an amount such that 40 ppm by mass of platinum metal is present relative to the total amount of the composition) and ethynylhexanol (in an amount corresponding to 600 ppm by mass relative to the total amount of the composition) and mixed uniformly to prepare a liquid hydrosilylation curable silicone composition 1 with a viscosity of 8,630 mPa.s at 25°C. The obtained silicone composition 1 was...

reference example 1

[0355] [Reference Example 1] (Synthesis of Silica Enhanced by Wet Hydrophobization)

[0356] First, make 277g octamethylcyclotetrasiloxane, 4.6g 1,3,5,7-tetramethyl-1,3,5,7-tetravinylcyclotetrasiloxane, 517g methyltrimethoxy The silane and 0.43 g of potassium hydroxide serving as a catalyst were reacted at a temperature of 105° C. for about 2 hours to produce a hydrophobic agent comprising ring-opened and rearranged organopolysiloxane. Potassium hydroxide was neutralized with carbon dioxide gas. When the resulting organopolysiloxane was analyzed, it was observed that the material was a linear organopolysiloxane containing 0.7 mol % of methylvinylsiloxane groups.

[0357] Next, wet hydrophobization reinforced silica was synthesized as follows using the hydrophobizing agent obtained as described above. Specifically, 118 g of methanol, 32 g of concentrated ammonia solution and 39 g of the hydrophobic agent obtained above were charged into a glass reaction container, and mixed...

reference example 2

[0358] [Reference Example 2] (Preparation of film-like thermosetting silicone sealing material)

[0359] First, 100 parts by mass of dimethylsiloxane-methylvinylsiloxane copolymer raw rubber (comprising 99.63 mole percent of dimethylsiloxane units and 0.37 mole percent of methylvinylsiloxane units and has a molecular terminal chain terminated by a dimethylvinylsiloxy group; degree of polymerization: 4,000) and 75 parts by mass of the wet-process hydrophobized reinforced silica (with 540m 2 / g BET method specific surface area) was charged into a kneader mixer and kneaded at 180°C for 60 minutes. After cooling, 3.0 parts by mass of methylhydrogenpolysiloxane having a viscosity of 7 mPa·s at 25° C. ) for chain termination) and a complex of chloroplatinic acid and 1,3-divinyltetramethyldisiloxane were mixed into the resulting silicone rubber base so that the amount of platinum metal was 10 ppm, and obtained Transparent thermosetting silicone rubber composition. The composition ...

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Abstract

The present invention relates to a hot-meltable curable silicone composition for compression molding or laminating and a laminate provided with at least one layer comprising the composition, as well as a semiconductor device using these and a method of manufacturing the same. In accordance with the present invention, it is possible to efficiently manufacture a semiconductor device provided with a hemi-spheroidal lens- or dome-shaped seal. In the present invention, it is easy to control the shape of the seal, and the seal does not contain any bubbles. In the present invention, it is also easy to control the thickness of the coating layer of the semiconductor device apart from the seal.

Description

[0001] priority claim [0002] This application claims the benefit of priority to US Provisional Patent Application No. 61 / 740,765, filed December 21, 2012, the disclosure of which is incorporated herein by reference in its entirety. technical field [0003] The present invention relates to a heat-fusible curable silicone composition for compression molding or lamination and a laminate having at least one layer comprising the composition, and a semiconductor device using these and a manufacturing method thereof. Background technique [0004] Examples of molding methods for sealing semiconductor elements include transfer molding and compression molding. Transfer molding has problems of wire displacement, wire deformation, filling defects, etc. caused by the sealing resin. Meanwhile, compression molding has a problem that the sealing resin contains air bubbles when the liquid sealing resin flows into the mold. Furthermore, since the thickness of the coating layer of the semi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D183/10C08G77/50C09J183/10H01L23/29B32B7/022B32B7/023B32B7/027
CPCC09D183/10H01L24/97H01L2224/32225C09J183/10H01L33/56H01L2224/97C08G77/50H01L2224/73265H01L2224/48227H01L2924/12041H01L2924/181H01L24/73Y10T428/24612Y10T428/24942Y10T428/24983Y10T428/31663B32B7/023B32B7/022B32B7/027H01L2924/00012H01L2924/00H01L2224/85H01L21/56C08K3/34C08K3/36C08K3/22B32B27/283B32B27/08B32B3/30C08K2003/2241B32B2250/24B32B2264/104B32B2307/418B32B2307/536B32B2457/14H01L23/296C08K2201/00H01L33/502
Inventor 吉田真宗吉武诚山崎春菜尼子雅章S·斯维尔中田稔树
Owner DOW SILICONES CORP
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