Ultraviolet cured high-conductivity conductive adhesive for PCB (printed circuit board)

A high-conductivity, PCB board technology, used in conductive adhesives, non-polymer adhesive additives, adhesive additives, etc., can solve the problem that conductive adhesives cannot meet the needs of electrical conductivity, and achieves improved activity and application range, Long-lasting effect and good compatibility

Inactive Publication Date: 2015-09-02
CHENGDU NASHUO TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] With the continuous development of the electronics industry, the standards for conductive adhesives continu

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0021] Example 1

[0022] A UV-curable high-conductivity conductive adhesive for PCB boards, consisting of the following raw materials in parts by mass: aromatic polyurethane acrylate: 15 parts, dimethylaminoethyl acrylate 5 parts, 1-hydroxycyclohexyl phenyl ketone 1 Parts, 1 part of nano aluminum oxide dispersion, 40 parts of flake nano silver powder, 10 parts of spherical nano silver powder, 0.2 parts of organic silicon leveling agent, 0.5 parts of antioxidant, 20 parts of graphene, 20 parts of nano titanium dioxide sol, 7 parts of silver ion solution and 1 part of vinyl triethoxy silane.

Example Embodiment

[0023] Example 2

[0024] A UV-curable high-conductivity conductive adhesive for PCB boards, which is composed of the following raw materials in parts by mass: aromatic polyurethane acrylate: 20 parts, dimethylaminoethyl acrylate 10 parts, 2-hydroxy-2-methyl-1 -6 parts of phenyl-1-acetone, 3 parts of nano aluminum oxide dispersion, 60 parts of flake nano silver powder, 20 parts of spherical nano silver powder, 0.5 part of acrylate leveling agent, 1 part of antioxidant, 25 part of graphene Parts, 25 parts of nano titanium dioxide sol, 12 parts of silver ion solution, 3 parts of vinyl triethoxy silane.

Example Embodiment

[0025] Example 3

[0026] A UV-curable high-conductivity conductive adhesive for PCB boards, which is composed of the following raw materials in parts by mass: aromatic polyurethane acrylate: 18 parts, dimethylaminoethyl acrylate 8 parts, diphenyl-(2,4,6 -4 parts of trimethyl benzoyl) phosphorus oxide, 2 parts of nano aluminum oxide dispersion, 55 parts of flake nano silver powder, 15 parts of spherical nano silver powder, 0.4 parts of silicone leveling agent, 0.8 parts of antioxidant, 22 parts of graphene, 22 parts of nano titanium dioxide sol, 10 parts of silver ion solution, 2 parts of vinyl triethoxysilane.

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PUM

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Abstract

The invention belongs to the field of coatings and in particular relates to an ultraviolet cured high-conductivity conductive adhesive for a PCB (printed circuit board). The ultraviolet cured high-conductivity conductive adhesive consists of the following raw materials in parts by mass: 15-20 parts of aromatic polyurethane acrylate, 5-10 parts of dimethylaminoethyl acrylate, 1-6 parts of a photoinitiator, 1-3 parts of nano aluminum oxide dispersoid, 40-60 parts of flaky nano silver powder, 10-20 parts of spherical nano silver powder, 0.2-0.5 part of a leveling agent, 0.5-1 part of an antioxidant, 20-25 parts of graphene, 20-25 parts of nano titanium dioxide sol, 7-12 parts of a silver ion solution and 1-3 parts of a crosslinking tackifier. According to the ultraviolet cured high-conductivity conductive adhesive provided by the invention, a small amount of spherical nano silver powder is used for filling flaky nano silver powder gaps, so that the resistivity can be reduced, and the conductive adhesive has relatively high adhesive property at the same time, has relatively long valid time, and has good compatibility with ultraviolet cured resin.

Description

technical field [0001] The invention belongs to the field of coatings, in particular to an ultraviolet-cured high-conductivity conductive adhesive for PCB boards. Background technique [0002] Conductive adhesive is a conductive material formed by uniformly dispersing conductive particles in resin. The conductive particles give it conductivity, and the resin makes it suitable for bonding. It is a material that has both conductivity and bonding properties. It can connect a variety of conductive materials together to form a conductive path between the connected materials. Different from other conductive polymers, conductive adhesives require the system to have fluidity under storage conditions, and can be cured by heating or other methods to form a connection with a certain strength. With the continuous advancement of science and technology, the rapid development of electronic components to miniaturization and miniaturization has promoted the development of conductive adhesi...

Claims

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Application Information

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IPC IPC(8): C09J175/14C09J9/02C09J11/04C09J11/06
Inventor 黄波
Owner CHENGDU NASHUO TECH
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