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Inorganic lightweight aggregate thermal insulation board and preparation method thereof

A thermal insulation board and lightweight aggregate technology, applied in the field of building materials, can solve the problems of harmfulness to the human body, heavy weight, high price, etc., and achieve the effect of good effect, light weight and stable quality

Inactive Publication Date: 2015-09-09
赵景歧
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of the defects of heavy weight, high price or harmful to human body existing in the existing inorganic thermal insulation materials, it is necessary to provide a light weight, non-toxic, low price inorganic lightweight aggregate thermal insulation board and its preparation method

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] An inorganic lightweight aggregate thermal insulation board, made of the following parts by weight of raw materials: 100 parts of inorganic lightweight aggregate, 10 parts of modified inorganic polymer powder, 0.2 part of organic silicon water repellent, and 0.7 part of curing agent , 0.2 parts of UV anti-ultraviolet agent, 15 parts of polyacrylate polymer latex, 100 parts of water.

[0026] The stated bulk density of inorganic lightweight aggregate is 100kg / m 3 ; Inorganic lightweight aggregate is ultra-light ceramic sand or floating beads made of expanded vitrified microbeads, fly ash, expanded straw powder or expanded wood chips.

[0027] The modified inorganic polymer powder is a water-soluble composite modified powder, which includes a silicone resin containing inorganic groups and a phenolic resin containing inorganic groups.

[0028] The curing agent is hexamethylenetetramine corresponding to the modified inorganic polymer powder.

[0029] The inorganic group contained i...

Embodiment 2

[0036] An inorganic lightweight aggregate thermal insulation board, made of the following parts by weight of raw materials: 100 parts of inorganic lightweight aggregate, 8 parts of modified inorganic polymer powder, 0.1 part of organic silicon water repellent, and 0.5 part of curing agent , 0.1 part of UV anti-ultraviolet agent, 10 parts of polyacrylate polymer latex, 80 parts of water.

[0037] The stated bulk density of inorganic lightweight aggregate is 80kg / m 3 ; Inorganic lightweight aggregate is ultra-light ceramic sand or floating beads made of expanded vitrified microbeads, fly ash, expanded straw powder or expanded wood chips.

[0038] The modified inorganic polymer powder is a water-soluble composite modified powder, which includes a silicone resin containing inorganic groups and a phenolic resin containing inorganic groups.

[0039] The curing agent is hexamethylenetetramine corresponding to the modified inorganic polymer powder.

[0040] The inorganic group contained in th...

Embodiment 3

[0047] An inorganic lightweight aggregate thermal insulation board, which is made of the following parts by weight: 100 parts of inorganic lightweight aggregate, 12 parts of modified inorganic polymer powder, 0.3 part of organic silicon water repellent, and 1 part of curing agent , 0.3 parts of UV anti-ultraviolet agent, 20 parts of polyacrylate polymer latex, 120 parts of water.

[0048] The stated bulk density of inorganic lightweight aggregate is 80kg / m 3 ; Inorganic lightweight aggregate is ultra-light ceramic sand or floating beads made of expanded vitrified microbeads, fly ash, expanded straw powder or expanded wood chips.

[0049] The modified inorganic polymer powder is a water-soluble composite modified powder, which includes a silicone resin containing inorganic groups and a phenolic resin containing inorganic groups.

[0050] The curing agent is hexamethylenetetramine corresponding to the modified inorganic polymer powder.

[0051] The inorganic group contained in the modif...

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Abstract

The invention discloses an inorganic lightweight aggregate thermal insulation board and a preparation method thereof. The inorganic lightweight aggregate thermal insulation board is characterized by being prepared from the following raw materials, by weight: 100 parts of inorganic lightweight aggregate, 8-12 parts of modified inorganic high-molecular powder, 0.1-0.3 part of an organosilicon water repellent, 0.5-1 part of a curing agent, 0.1-0.3 part of an anti-ultraviolet agent, 10-20 parts of polyacrylate latex, and 80-120 parts of water. The inorganic lightweight aggregate thermal insulation board is prepared by adopting raw material with the ratio above and by compression molding and curing. According to the invention, expanded wood chip or straw powder is adopted to replace conventional expanded perlite, so that the board is light in quality and high in toughness; and the anti-ultraviolet auxiliary agent is added to provide the board with better application effect in the outdoor.

Description

Technical field [0001] The invention belongs to the technical field of building materials, and in particular relates to an inorganic lightweight aggregate thermal insulation board and a preparation method thereof. Background technique [0002] Insulation materials are materials with a guiding thermal coefficient of less than or equal to 0.2, which are divided into three categories: inorganic insulation materials, organic insulation materials, and composite insulation materials. Traditional thermal insulation materials are mainly based on increasing the porosity of the gas phase and reducing the thermal conductivity and conductivity; the fiber thermal insulation materials must have a thicker coating to increase the convective and radiative heat transfer in the use environment ; While the profile-like inorganic insulation materials need to be assembled and constructed, and there are defects such as many joints, detrimental beauty, poor waterproofness, and short service life. [0003...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B26/04C04B14/24C04B18/08C04B18/24
CPCY02W30/91
Inventor 赵景歧
Owner 赵景歧