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Thermosetting resin composition, cured product, and method for producing modified phenol resin

A resin composition and thermosetting technology, applied in the field of thermosetting resin composition, can solve problems such as improvement and increase in the exclusive area of ​​semiconductor chips, and achieve the effect of high shrinkage rate

Inactive Publication Date: 2018-09-11
AICA KOGYO CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] In addition, Patent Document 4 discloses that in addition to miniaturization and thinning of the single-sided sealing type package, the dedicated area of ​​the semiconductor chip increases, and the demand for solving the problem of convex warpage at room temperature contrary to the conventional one is increasing.

Method used

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  • Thermosetting resin composition, cured product, and method for producing modified phenol resin
  • Thermosetting resin composition, cured product, and method for producing modified phenol resin
  • Thermosetting resin composition, cured product, and method for producing modified phenol resin

Examples

Experimental program
Comparison scheme
Effect test

manufacture example 1

[0131] Production example 1 (synthesis of modified phenol resin A)

[0132] Into a flask equipped with a cooling tube and a stirrer, 104 g of a phenol novolak resin with a trade name of "Shounol (trademark) BRG-558" (manufactured by Showa Denko Co., Ltd., hydroxyl equivalent 104 g / eq.) and methyl ethyl ketone were added. 50 g, 0.04 g of hydroquinone, and 43 g of glycidyl methacrylate were mixed at 60°C until they became uniform. After cooling to below 40°C, 2 g of triphenylphosphine was added. After reacting at 100° C. for 5 hours, fractions were removed from the product at 120° C. under a reduced pressure of 50 mmHg to obtain 147 g of modified phenol resin A in the form of a light brown block. The obtained modified phenol resin A had a softening point of 83° C. and a weight average molecular weight of 1900.

manufacture example 2～3、 comparative manufacture example 2～4

[0134] Except having used the composition of Table 1, it reacted similarly to manufacture example 1, and modified phenol resin B-C, J-L shown in Table 2, 3 were obtained.

manufacture example 4

[0136] In a flask equipped with a cooling tube and a stirrer, add 200 g of bisphenol F and 100 g of methyl ethyl ketone to dissolve them, then add 0.08 g of hydroquinone and 56 g of glycidyl methacrylate and mix until uniform, then add triphenyl Phosphine 2g. After reacting at 100° C. for 5 hours, fractions were removed from the product at 120° C. under a reduced pressure of 50 mmHg to obtain 256 g of modified phenol resin D.

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Abstract

The invention discloses a Thermosetting resin composition,condensate and manufactur method for modified urushiol resinSubject of the present invention is to provide available when curing thermosetting resins with high shrinkage of cured composite with excellent heat resistance and flame retardancy as well as with the curing. A thermosetting resin combination, its contains the general formula (I) is shown in (A) modified phenolic resin and epoxy resin (B), the modified phenolic resin (A) of the total content of alkali, alkaline earth metal relative to the amount of phenolic resin (A) above 0.1 mass % the following, and the modified phenolic resin (A) the amine series compounds content relative to the amount of phenolic resin (A) above 0.1 mass %. (img file = 'DDA0000669439150000011. TIF wi =' 1536 'he =' 411 ' / ) (type, the R1 for hydrogen atoms or groups as shown in the following type (II), all R1, R1 for hydrogen atom is more than 20% and less than 80%. The proportion of the R2 and R3 independently of hydrogen or carbon atom number 1 ~ 20 aliphatic or aromatic hydrocarbon. An integer n is 0 ~ 40.) (img file = 'DDA0000669439150000012. TIF wi =' 1752 'he =' 373 ' / ) (type, R4 to hydrogen atoms or methyl.

Description

technical field [0001] The present invention relates to a thermosetting resin composition, a cured product and a method for producing a modified phenolic resin. Background technique [0002] Thermosetting resin compositions that combine epoxy resins and phenol resins (curing agents) are used in various fields because cured products of such thermosetting resin compositions are excellent in heat resistance, adhesiveness, and electrical insulation. . For example, resin compositions for printed circuit boards, resin compositions for interlayer insulating materials used for printed circuit boards and copper foil with resin, resin compositions for sealing materials of electronic parts, resist inks, conductive Conductive pastes, coatings, adhesives, composite materials, etc. for fillers. [0003] Semiconductor integration is increasing year by year in a manner that follows Moore's Law. In addition, since semiconductor packages also respond to the high integration of semiconducto...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G59/62C08K3/36C08K5/50
CPCC08G59/06C08K5/53C08L61/06
Inventor 泷本进一山腰千巳新美仁志
Owner AICA KOGYO CO LTD