A vertical interconnection structure with electromagnetic shielding effect and manufacturing method thereof

A vertical interconnection, electromagnetic shielding technology, applied in circuits, electrical components, electrical solid devices, etc., can solve problems such as electromagnetic leakage, achieve small size, solve electromagnetic leakage, and good heat dissipation effect.

Active Publication Date: 2018-03-16
SHANGHAI SPACEFLIGHT ELECTRONICS & COMM EQUIP RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of the problems existing in the above-mentioned prior art, the present invention proposes a vertical interconnection structure with electromagnetic shielding performance and its manufacturing method, which effectively solves the electromagnetic leakage problem existing in the existing vertical interconnection structure

Method used

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  • A vertical interconnection structure with electromagnetic shielding effect and manufacturing method thereof
  • A vertical interconnection structure with electromagnetic shielding effect and manufacturing method thereof
  • A vertical interconnection structure with electromagnetic shielding effect and manufacturing method thereof

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Embodiment 1

[0054] to combine Figure 1-Figure 4 , this embodiment describes in detail the vertical interconnection structure with electromagnetic shielding performance of the present invention, which may include any one or more of a single-channel vertical interconnection structure 2, a multi-channel vertical interconnection structure 3, and a differential vertical interconnection structure , this embodiment includes a single-channel vertical interconnection structure 2, a multi-channel vertical interconnection structure 3 and a differential vertical interconnection structure 4 as an example, and its structural diagram is as follows figure 1 As shown, the top view is as figure 2As shown, the single-channel vertical interconnect structure 2 includes a solid metal via 101, an annular metal shielding layer 102 surrounding the solid metal via 21, and an annular metal shield between the solid metal via 101 and the metal shielding layer 102. The insulating dielectric metal oxide 103; the mul...

Embodiment 2

[0061] combine Figure 5 - Fig. 6, this embodiment describes in detail the fabrication method of the vertical interconnection structure with electromagnetic shielding function of the present invention, its flow chart is as follows Figure 5 shown, including the following steps:

[0062] S11: providing a metal substrate 1, coating a layer of photosensitive material on the upper and lower surfaces of the metal substrate 1 for the first time, performing double-sided photolithography for the first time, and forming a pattern mask 11 of a vertical interconnection structure;

[0063] S12: Perform dense anodic oxidation on the metal substrate after forming the pattern mask of the vertical interconnection structure, and form a dense metal oxide layer in the area not covered by the pattern mask of the vertical interconnection structure;

[0064] S13: Use chemical etching and sputter etching to remove the pattern mask of the vertical interconnection structure, coat a layer of photosens...

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Abstract

The invention discloses a vertically-interconnected structure provided with an electromagnetic shielding effect and a manufacturing method thereof. The structure comprises solid metal through columns, metal shielding layers and metal oxide; wherein the solid metal through columns are metal conductors vertically-interconnected among any layers in a packaging substrate; the metal shielding layers are annular metal shielding layers covering the solid metal through columns; and the metal oxide is an annular insulating medium arranged between the metal solid metal through columns and the metal shielding layers. The method comprises the steps of: carrying out photo-etching for the first time to form pattern masks of a vertically-interconnected structure on up and down surfaces of a substrate; carrying out compact-type anodization; removing the pattern masks of the vertically-interconnected structure, and carrying out photo-etching for the second time to form pattern masks of the solid metal through columns and pattern masks of the metal shielding layers on the up and down surfaces of the substrate; carrying out penetrating-type anodization; and removing the pattern masks of the solid metal through columns and the pattern masks of the metal shielding layers. The vertically-interconnected structure and the manufacturing method thereof effectively solve the electromagnetic leakage problem.

Description

technical field [0001] The invention relates to the field of electronic packaging, in particular to a vertical interconnection structure with electromagnetic shielding effect and a manufacturing method thereof. Background technique [0002] With the continuous development of electronic systems in the direction of high frequency, high speed, multi-function, and miniaturization, packaging and interconnection has increasingly become a bottleneck for improving the overall performance of the system. In particular, the vertical interconnect structure in the package is an important impedance discontinuity point in the signal transmission path, and it is the root cause of signal integrity problems such as reflection, ringing, loss, and crosstalk. Due to the limitations of existing processing methods, the current substrate technology does not produce vertically interconnected shielding structures. Electromagnetic waves passing through the vertical interconnect structure can be direc...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/525H01L23/58
CPCH01L2224/16225H01L2224/48227H01L2924/15311
Inventor 谢慧琴陈靖丁蕾刘凯王立春
Owner SHANGHAI SPACEFLIGHT ELECTRONICS & COMM EQUIP RES INST
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