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High-reliability welding method for lead ceramic thermal resistor

A technology of thermistor and welding method, which is applied in the field of lead ceramic thermistor welding and ceramic thermistor welding, can solve the problems such as the decrease of solder dissolution force, achieve the enhancement of solder dissolution force, and ensure long-term high pressure resistance , the effect of enhancing reliability

Active Publication Date: 2015-09-30
JIANGSU NEW LINZHI ELECTRONIC TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of the deficiencies in the prior art above, the purpose of the present invention is to provide a welding method for leaded ceramic thermistors with high reliability, which solves the problem that the solder dissolution force of product welding decreases

Method used

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  • High-reliability welding method for lead ceramic thermal resistor

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Effect test

Embodiment 1

[0010] Embodiment 1. The specific manufacturing process of the ceramic thermistor involved in this embodiment is as follows. The substrate is obtained through batching, wet ball milling, pre-firing, secondary wet ball milling, granulation, molding, and sintering. After the substrate is cleaned, the electrodes are sputtered for sorting. Then use special welding equipment to weld the chip and the lead wire. The solder is made of SnCu alloy tin (containing 1-3% copper), and the wire material is tinned copper wire or tinned copper-clad steel wire. The outer diameter of the wire: Φ0.5~ 1.0mm.

[0011] The steps for welding are

[0012] 1. Wire bonding adjustment: through the selection of different molds, the P width between the leads is controlled to meet the product size requirements.

[0013] 2. Tin adjustment: through the adjustment of the amount of tin in the solder joints, to ensure the reliability of the solder joints of the product.

[0014] 3. Adjustment of suction piece...

Embodiment 2

[0017] Embodiment 2. The specific manufacturing process of the ceramic thermistor involved in this embodiment is as follows. The substrate is obtained through batching, wet ball milling, pre-firing, secondary wet ball milling, granulation, molding, and sintering. After the substrate is cleaned, the electrodes are sputtered for sorting. Then use special welding equipment to weld the chip and the lead wire. The solder is made of SnCu alloy tin (containing 1-3% copper), and the wire material is tinned copper wire or tinned copper-clad steel wire. The outer diameter of the wire: Φ0.5~ 1.0mm.

[0018] The steps for welding are

[0019] 1. Wire bonding adjustment: through the selection of different molds, the P width between the leads is controlled to meet the product size requirements.

[0020] 2. Tin adjustment: through the adjustment of the amount of tin in the solder joints, to ensure the reliability of the solder joints of the product.

[0021] 3. Adjustment of suction piece...

Embodiment 3

[0024] Embodiment 3. The specific manufacturing process of the ceramic thermistor involved in this embodiment is as follows. The substrate is obtained through batching, wet ball milling, pre-firing, secondary wet ball milling, granulation, molding, and sintering. After the substrate is cleaned, the electrodes are sputtered for sorting. Then use special welding equipment to weld the chip and the lead wire. The solder is made of SnCu alloy tin (containing 1-3% copper), and the wire material is tinned copper wire or tinned copper-clad steel wire. The outer diameter of the wire: Φ0.5~ 1.0mm.

[0025] The steps for welding are

[0026] 1. Wire bonding adjustment: through the selection of different molds, the P width between the leads is controlled to meet the product size requirements.

[0027] 2. Tin adjustment: through the adjustment of the amount of tin in the solder joints, to ensure the reliability of the solder joints of the product.

[0028] 3. Adjustment of suction piece...

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Abstract

The invention discloses a high-reliability welding method for a lead ceramic thermal resistor. The method includes the steps that routing adjustment is conducted, wherein the widths between leads are controlled; tinning adjustment is conducted, wherein the tin soldering amount of welding spots is adjusted; chip sucking and inserting adjustment is conducted, wherein the geometric dimensions of the formed lead products and chips are guaranteed through the adjustment; welding is carried out, wherein the leads and the chips are sequentially fed into a preheating area, a hot-gas welding area and a heat preservation area, the preheating area is divided into six preheating sections, and the hot-gas welding area is divided into two hot-gas welding sections. By the adoption of the method, tin soldering carrion capacity of fused tin between the leads and a PTC electrode face is enhanced, the welding reliability is improved, and the requirements for long-term high voltage resistance and high current withstanding capability of the ceramic thermal resistor are guaranteed.

Description

technical field [0001] The invention relates to a ceramic thermistor welding method, in particular to a lead wire ceramic thermistor welding method with high reliability, and belongs to the technical field of thermistor manufacture. Background technique [0002] Leaded ceramic thermistor refers to soldering two pins on the two electrodes of the ceramic thermistor chip, and then encapsulating the body with encapsulation material to meet the needs of automatic plug-in. The lead wire plays the role of contact conduction when the ceramic thermistor is assembled, and the welding strength of the lead ceramic thermistor directly affects the performance of the ceramic thermistor. For example, the domestic YD / T741-2002 standard requires that in the technical requirements of positive temperature coefficient (PTC) thermistors for communication overcurrent protection, the failure mode required for PTC thermistors with a withstand voltage of 600V: AC600V, initial current 15A, The power-...

Claims

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Application Information

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IPC IPC(8): B23K1/00
CPCB23K1/0016
Inventor 何正安汪鹰孙振华
Owner JIANGSU NEW LINZHI ELECTRONIC TECH CO LTD
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