Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Packaging material, organic light-emitting diode device, and packaging method for organic light-emitting diode device

A technology of light-emitting diodes and packaging materials, which is applied in the manufacture of semiconductor devices, electrical solid devices, and semiconductor/solid-state devices. It can solve problems that affect the appearance of transparent display devices, and achieve the effects of isolating damage, small impact, and good sealing performance

Active Publication Date: 2015-10-07
BOE TECH GRP CO LTD
View PDF3 Cites 8 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The present invention aims at the problem that the packaging structure formed by the existing packaging material is black, thereby affecting the appearance of the transparent display device, and provides a packaging material that can form a colorless and transparent packaging structure and can be used for a transparent display device, an organic light emitting diode device and the like. Encapsulation method

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Packaging material, organic light-emitting diode device, and packaging method for organic light-emitting diode device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0079] The composition of the packaging material main component of the present embodiment is:

[0080] Ytterbium trioxide (rare earth metal oxide): 40wt%;

[0081] Zinc oxide: 20wt%;

[0082] Aluminum oxide: 20wt%;

[0083] Silica: 20 wt%.

[0084] The laser wavelength used for packaging is: 975nm.

[0085] The performance of the package structure formed by the package material is:

[0086] Color: colorless and transparent;

[0087] Expansion coefficient: -85×10 -7 / °C

[0088] Oxygen barrier capacity: 0.8×10 -3 cm 3 / Meter 2 / sky;

[0089] Water blocking ability: 0.75×10 -6 g / m 2 / sky.

Embodiment 2

[0091] The composition of the packaging material main component of the present embodiment is:

[0092] Cerium oxide (rare earth metal oxide): 80wt%;

[0093] Zinc oxide: 1wt%;

[0094] Aluminum oxide: 14wt%;

[0095] Silica: 5 wt%.

[0096] The performance of the packaging structure formed by the packaging material is:

[0097] The laser wavelength used for packaging is: 244nm.

[0098] The performance of the package structure formed by the package material is:

[0099] Color: colorless and transparent;

[0100] Expansion coefficient: -75×10 -7 / °C

[0101] Oxygen barrier capacity: 0.77×10 -3 cm 3 / Meter 2 / sky;

[0102] Water blocking ability: 0.7×10 -6 g / m 2 / sky.

Embodiment 3

[0104] The composition of the packaging material main component of the present embodiment is:

[0105] Europium trioxide and terbium trioxide (rare earth metal oxide): 75wt%, wherein the mass ratio of europium trioxide and terbium trioxide is 1:1;

[0106] Zinc oxide: 13wt%;

[0107] Aluminum oxide: 2wt%;

[0108] Silica: 10 wt%.

[0109] The laser wavelength used for packaging is: 364nm.

[0110] The performance of the package structure formed by the package material is:

[0111] Color: colorless and transparent;

[0112] Expansion coefficient: -91×10 -7 / °C

[0113] Oxygen barrier capacity: 0.88×10 -3 cm 3 / Meter 2 / sky;

[0114] Water blocking ability: 0.9×10 -6 g / m 2 / sky.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a packaging material, an organic light-emitting diode device, and a packaging method for the organic light-emitting diode device, belongs to the technical field of packaging, and can solve a problem that the beauty of a transparent display is affected because a packaging structure made of conventional packaging materials is black. The packaging material contains a main component, and the main component contains rare-earth oxide, zinc oxide, aluminium oxide, and silica. The packaging material can be used for packaging, especially the packaging of the organic light-emitting diode device.

Description

technical field [0001] The invention belongs to the technical field of encapsulation, and in particular relates to an encapsulation material, an organic light emitting diode device and an encapsulation method thereof. Background technique [0002] Organic light-emitting diode (OLED) devices, as an emerging flat-panel display, have attracted special attention because of their advantages such as good color contrast, active light emission, wide viewing angle, thinner profile, fast response, and low energy consumption. However, organic light-emitting diodes, especially electrodes and organic layers therein, are easily degraded due to the entry of oxygen and moisture in the surrounding environment into the organic light-emitting diode device, which seriously affects its service life. If the electrodes and organic layers within an organic light-emitting diode are hermetically sealed (encapsulated) from the surrounding environment, their lifetime will be significantly increased. ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/50H01L51/54H01L51/56
CPCH10K50/8426H10K71/421H10K50/00H10K71/00
Inventor 李娜
Owner BOE TECH GRP CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com