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Chip packaging material for computer

A chip packaging and computer technology, applied in electrical components, circuits, other chemical processes, etc., can solve the problems of complex computer chips and achieve the effect of improving the refractive index

Inactive Publication Date: 2015-10-14
龚灿锋
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

There are many chips on the computer. The black strips on the memory stick are chips. There are many chips on the motherboard, hard disk, graphics card, etc. The CPU is also a computer chip, but it is more complicated and more complex than ordinary computer chips. precision

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] The computer chip encapsulation material in the present embodiment is made up of the following components by mass: o-cresol novolac epoxy resin is 15 parts, diphenylmethylene diisocyanate is 6 parts, vinyltrimethoxysilane is 4 parts Parts, 18 parts of phenyl vinyl silicone oil, 8 parts of phenyl hydrogen silicone resin, 3 parts of ethylene glycol diglycidyl ether, 6 parts of methyl hexahydrophthalic anhydride, poly-p-phenylene terephthalamide 8 parts, 8 parts of vinyl methyl nano MQ silicone resin.

[0026] The above-mentioned encapsulation preparation method comprises the following steps:

[0027] (1) Take the o-cresol novolac epoxy resin, diphenylmethylene diisocyanate, phenyl hydrogen-containing silicone resin, and ethylene glycol diglycidyl ether in the above parts by mass, and mix o-cresol novolac epoxy resin, diphenyl The four components of methylethylene diisocyanate, phenyl hydrogen-containing silicone resin, and ethylene glycol diglycidyl ether are dissolved a...

Embodiment 2

[0033] The computer chip encapsulation material in the present embodiment is made up of the following components by mass: o-cresol novolac epoxy resin is 17 parts, diphenylmethylene diisocyanate is 9 parts, vinyltrimethoxysilane is 6 parts Parts, 20 parts of phenyl vinyl silicone oil, 9 parts of phenyl hydrogen-containing silicone resin, 4 parts of ethylene glycol diglycidyl ether, 8 parts of methyl hexahydrophthalic anhydride, poly-p-phenylene terephthalamide 10 parts, 9 parts of vinyl methyl nano MQ silicone resin.

[0034] The above-mentioned encapsulation preparation method comprises the following steps:

[0035] (1) Take the o-cresol novolac epoxy resin, diphenylmethylene diisocyanate, o-cresol novolac epoxy resin, and ethylene glycol diglycidyl ether in the above parts by mass, and mix o-cresol novolac epoxy resin, diphenyl The four components of methylethylene diisocyanate, phenyl hydrogen-containing silicone resin, and ethylene glycol diglycidyl ether are dissolved af...

Embodiment 3

[0041] The computer chip encapsulation material in the present embodiment is made up of the following components by mass: o-cresol novolac epoxy resin is 19 parts, diphenylmethylene diisocyanate is 12 parts, vinyltrimethoxysilane is 8 parts Parts, 22 parts of phenyl vinyl silicone oil, 10 parts of phenyl hydrogen-containing silicone resin, 5 parts of ethylene glycol diglycidyl ether, 10 parts of methyl hexahydrophthalic anhydride, polyparaphenylene terephthalamide 12 parts, 10 parts of vinyl methyl nano MQ silicone resin.

[0042] The above-mentioned encapsulation preparation method comprises the following steps:

[0043] (1) Take the o-cresol novolac epoxy resin, diphenylmethylene diisocyanate, o-cresol novolac epoxy resin, and ethylene glycol diglycidyl ether in the above parts by mass, and mix o-cresol novolac epoxy resin, diphenyl The four components of methylethylene diisocyanate, phenyl hydrogen-containing silicone resin, and ethylene glycol diglycidyl ether are dissolv...

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Abstract

The invention relates to a chip packaging material for a computer. The chip packaging material comprises the following components, by mass: 15-19 parts of an o-cresol formaldehyde epoxy resin, 6-12 parts of methylene diphenyl diisocyanate, 4-8 parts of vinyltrimethoxy silane, 18-22 parts of phenylvinylsilicone oil, 8-10 parts of a phenyl hydrogen-containing silicon resin, 3-5 parts of ethylene glycol diglycidyl ether, 6-10 parts of methylhexahydrophthalic anhydride, 8-12 parts of poly-p-phenylene terephthalamide, and 8-10 parts of a nanometer vinylmethyl MQ silicon resin. According to the invention, by optimizing the chip packaging material for the computer, the refractive index, hardness, and bonding strength of the chip packaging material for the computer are obviously improved. The chip packaging material, prepared by a method in the invention, for the computer has the shore hardness from 68A to 74A, and the bonding strength from 6.8 MPa to 7.6 MPa.

Description

technical field [0001] The invention relates to a computer chip packaging material, which belongs to the technical field of computer chips. Background technique [0002] A computer chip is actually an electronic component. A computer chip contains tens of thousands of resistors, capacitors and other small components. There are many chips on the computer. The black strips on the memory stick are chips. There are many chips on the motherboard, hard disk, graphics card, etc. The CPU is also a computer chip, but it is more complicated and more complex than ordinary computer chips. precision. Chips include South Bridge chips and North Bridge chips. The chip is the heart of the motherboard, and the CPU is the heart of the computer. However, there are many types of chips. For example, CPU can also be called a chip, and there are also graphics card chips, sound card chips, etc. Most of them are used for computing. For the packaging of the chip, it is necessary to use suitable mat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/04C08L83/07C08L83/05C08L77/10C08K5/5425C08G59/42C09K3/10H01L23/29
Inventor 龚灿锋
Owner 龚灿锋
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