Flexible device and preparation method thereof
A technology of flexible devices and negative active materials, which is applied in the direction of electrical components, structural parts, climate sustainability, etc., can solve the problems of decreased bonding strength, great difficulty, and easy fatigue, etc., to increase the bonding strength and prepare The process is simple and the effect of increasing the contact area
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Examples
Embodiment 1
[0038] Preparation of porous current collector: select a copper foil with a thickness of 1 μm as the base layer; select a copper foil with a thickness of 100 μm, and then use laser drilling to drill holes in the copper foil to obtain a circular hole shape and a hole diameter 2 μm, hole spacing (edges of two holes) of 1 μm, and hole depth of 100 μm, so as to obtain a porous structure layer of a porous current collector; the above porous structure layer and collective layer are cut, and then the porous structure layer is bonded with conductive glue Connected to the base layer to obtain a porous current collector for use;
[0039] Negative sheet preparation: use silicon-carbon composite (30% silicon content) as the negative electrode active material, PVDF as the binder, Supper-P as the conductive agent (the mass ratio of the three is 94:3:3), and NMP as the solvent configuration Slurry; then coated on the surface of the above-mentioned porous current collector containing the pore...
Embodiment 2
[0042] The difference from Example 1 is that it includes the following steps:
[0043] Preparation of porous current collector: copper foil with a thickness of 10 μm is selected as the base layer.
[0044] The rest are the same as in Embodiment 1 and will not be repeated here.
Embodiment 3
[0046] The difference from Example 1 is that it includes the following steps:
[0047] Preparation of porous current collector: select a copper foil with a thickness of 15 μm as the base layer; select a copper foil with a thickness of 100 μm, and then use laser drilling to drill holes on the copper foil to obtain a circular hole shape and a hole diameter The porous structure layer of the porous current collector is obtained by cutting the porous structure layer and the collective layer, and then using the conductive glue porous structure layer Bonded on the base layer to obtain a porous current collector for use;
[0048] Negative sheet preparation: use silicon-carbon composite (30% silicon content) as the negative electrode active material, PVDF as the binder, Supper-P as the conductive agent (the mass ratio of the three is 94:3:3), and NMP as the solvent configuration Slurry; then coated on the surface of the above-mentioned porous current collector containing the pore stru...
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Abstract
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