Fine circuit printed board etching process

Abstract

The invention relates to a fine circuit printed board etching process, which comprises the steps of S1, opening a cylinder and preparing a solution; S2, carrying out startup checking; S3, starting up; S4, carrying out initial workpiece etching, wherein the initial workpiece etching is carried out on each model of printed board; wherein the specific operating steps of initial workpiece etching are as follows: S41, surface cleaning; S42, dry film attaching; S43, etching, that is, a printed board is placed in a stainless steel hanging basket with the upper part and the lower part being fixed, the stainless steel hanging basket is put in the etching bath prepared in the step 1, the temperature in the etching bath is controlled to be 45-53 DEG C, the nozzle pressure is 2.0-3.5kg/cm2, and the stainless steel hanging basket vibrates slightly for 3min-5min and is then taken out after a window is dissolved; S44, washing; S45, ink retreating; and S46, detection; and S5, carrying out mass production, that is, a plurality of printed boards with the same model are placed on a production line to carry out mass production according to the steps S41-S45 after the printed board is detected to be qualified in the step S46, and spot check is carried out in the mass production process. The advantages of the fine circuit printed board etching process lie in that occurrence of mass unqualified products can be avoided, and the etching effect is good.

Description

technical field [0001] The invention relates to the technical field of production of printed circuit boards, in particular to the etching process of fine circuit printed boards. Background technique [0002] At present, the design and connection of all electronic instrument circuits are mostly based on printed circuit boards. With the advancement of science and technology in the electronics industry, printed boards are developing in the direction of multi-layer and densification, and the etching process has gradually changed from the previous extensive type. To professional development. Etching is a necessary process in the production of printed circuit boards, but with the improvement of its fineness, the traditional etching process has begun to be impossible, especially the problem of side etching is becoming more and more serious. The method often used in the electronics industry to corrode copper foil support printed circuit boards is the ferric chloride chemical corros...

AI Technical Summary

Problems solved by technology

Etching is a necessary process in the production of printed circuit boards, but with the improvement of its fineness, the traditional etching process has begun to be impossible, especially the problem of side etching is becoming more and more serious

Ferric chloride chemical corrosion method is often used in the electronic industry to corrode copper foil support printed circuit boards. It has the following disadvantages: it cannot be applied to the new process of reverse plating method; the consumption of ferric chloride is large; the corrosion solution Small capacity; poor working conditions, etc.

The process of treating the used solution is more complicated, and the recovery of copper and the regeneration of ferric chloride require more complicated equipment and larger investment

[0003]In the production of fine circuit boards, it is often necessary to open a window of the size required by the design in some a