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Method of producing conductive coating film, and conductive coating film

A manufacturing method and conductivity technology, applied in conductive coatings, printed circuit manufacturing, cable/conductor manufacturing, etc., can solve the problems of reduced and insufficient adhesion of insulating substrates, reduce the reduction of adhesion, and improve high temperature Durability, improve the effect of sintering

Inactive Publication Date: 2015-11-04
TODA IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] However, it is desired to further improve the conductivity of the coating film obtained by the conductive paste containing copper powder, but it is not yet sufficient.
In addition, in the superheated steam treatment, the higher the treatment temperature is, the better the conductivity becomes, but the adhesion to the insulating substrate tends to decrease.

Method used

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  • Method of producing conductive coating film, and conductive coating film
  • Method of producing conductive coating film, and conductive coating film
  • Method of producing conductive coating film, and conductive coating film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0087] The composition of the following compounding ratio was put into the sand mill, and it dispersed at 800 rpm for 2 hours. As the media, zirconia beads with a radius of 0.2 mm were used. Apply the obtained copper paste on the resin cured layer of the polyimide film (AC-1) with a resin cured layer using an applicator so that the thickness after drying is 2 μm, and dry it with hot air at 120° C. for 5 minutes to obtain Coating films containing copper powder.

[0088]

[0089] Copolymerized polyester solution 2.5 parts

[0090] (40% by weight solution of toluene / cyclohexanone=1 / 1 (weight ratio))

[0091] Copper powder 1 (average particle size 0.12μm) 9 parts

[0092] 3.5 parts of γ-butyrolactone (diluted solvent)

[0093] 5 parts of methyl ethyl ketone (diluent solvent)

[0094] Oxetane 0.2 parts

[0095] (Copolymerized polyester: "RV290" manufactured by Toyobo Co., Ltd.

[0096] Oxetane: "OXT-221" manufactured by Toagosei Co., Ltd.)

[0097] The obtained polyimide ...

Embodiment 2～4

[0099] Similar to Example 1, however, the organic acid (salt) used for the organic acid (salt) treatment was changed as described in Table 1, and a conductive coating film was obtained. Table 1 shows the evaluation results of the obtained conductive coating film.

Embodiment 5～6

[0101] In the same manner as in Example 1, however, AC-2 was used on the insulating substrate, copper powder 2 was used as the copper powder, and the organic acid (salt) used for the organic acid treatment was changed as described in Table 1 to obtain electrical conductivity. coating film. In Examples 5 and 6, superheated steam treatment was performed at 330°C. Table 1 shows the evaluation results of the obtained conductive coating film.

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Abstract

The purpose of the present invention is to provide a conductive coating film formed on an insulating substrate using a copper paste and having excellent conductivity and adhesiveness to the insulating substrate. This method of producing the conductive coating film involves a step for forming a coating film on the insulating substrate using a copper paste which has a copper powder, a binder resin and a solvent as the main components, and drying the same to obtain a copper powder-containing coating film, a step for treating said copper powder-containing coating film with an organic acid or organic acid salt, and a step for heat-treating the copper powder-containing coating film with superheated steam. This method enables obtaining a conductive coating film with excellent conductivity and also with excellent adhesiveness to the insulating substrate.

Description

technical field [0001] The present invention relates to a method for producing a conductive coating film excellent in adhesion to an insulating substrate and conductivity, and a conductive coating film produced by the production method. Background technique [0002] In recent years, the densification of conductive circuits has been rapidly increased. Conventionally, the erasing method for forming a pattern by etching copper foil bonded to an insulating substrate, which is used in the formation of a conductive circuit, has a long and complicated process and generates a large amount of waste. In addition, in this method of forming a circuit by etching copper foil, unintended lateral etching may occur in the lower portion of the circuit, and there is a limit in the width of the circuit that can be formed. Therefore, instead of the elimination method, attention is paid to the additive or semi-additive method of forming a circuit by plating. Furthermore, a printing method or a ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B13/00H01B5/14H05K3/12
CPCH05K1/095C09D5/24H05K3/1283H05K2203/088C09D7/68C09D7/61H01B1/026H01B5/14H01B13/30
Inventor 八塚刚志伊藤千穗柿原康男
Owner TODA IND
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