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Manufacturing method of welding pull pins

A production method and solder ball technology, applied in the direction of welding equipment, manufacturing tools, auxiliary devices, etc., can solve the problems of cracking and easy breakage of PCB pads, and achieve the effect of pertinence, strong controllability and simple operation.

Active Publication Date: 2015-11-11
GUILIN UNIV OF ELECTRONIC TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

These changes not only make the printed circuit board more brittle and more prone to breakage, but also cause the interface layer at the bottom of the PCB pad to withstand higher thermal stress, which is prone to common PCB pad cratering

Method used

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  • Manufacturing method of welding pull pins
  • Manufacturing method of welding pull pins
  • Manufacturing method of welding pull pins

Examples

Experimental program
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Effect test

Embodiment

[0027] Such as figure 1 Shown, a kind of manufacturing method of welding pin, comprises the steps:

[0028] 1) Select pin 7. In this embodiment, a copper-plated pin with a diameter of 0.45mm is used, and solder ball template 1 is selected. The template material in this embodiment is bakelite, such as figure 2 shown;

[0029] 2) According to the pin diameter of 0.45 mm, the diameter of the solder ball 8 required for the pin 7 is selected to be 0.6 mm, and the arrayed hemispherical groove 2 corresponding to the diameter of the solder ball 8 is set on the solder ball template 1, as shown in figure 2 As shown, the radius of groove 2 is 1mm;

[0030] 3) Fill the solder paste 3 in the groove 2 of the solder ball template 1, such as image 3 shown;

[0031] 4) Make a positioning template 4 containing an array of positioning holes 6, and fix the positioning template 4 directly above the solder ball template 1 through the pillar 5, wherein the positions of the array positioning h...

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Abstract

The invention discloses a manufacturing method of welding pull pins. The method comprises the steps that firstly, the pull pins and a welding ball template are selected; secondly, the diameter of welding balls is determined, and array type grooves matched with the welding balls in diameter are formed in the welding ball template; the grooves of the welding ball template are filled with soldering paste; fourthly, a positioning template comprising array positioning holes is manufactured, the positioning template is fixed to the portion over the welding ball template, and an upper template component and a lower template component are formed in a centering manner; fifthly, the pull pins are vertically placed in the positioning holes of the positioning template, and the lower ends of the pull pins make contact with the soldering paste with which the grooves of the welding ball template are filled; sixthly, the upper template component and the lower template component are placed in a reflux furnace, the soldering paste in the grooves of the welding ball template is molten, and the welding balls are formed at one ends of the pull pins; and seventhly, the positioning template and the welding ball template are dismounted, and the welding pull pins are obtained. According to the method, the steps are simple, pertinence is high, and the standardization and uniformity of the welding pull pins obtained through the method are good.

Description

technical field [0001] The invention relates to the manufacturing technology of the pad quality detection consumables of printed circuit boards, in particular to a manufacturing method of welding pins. technical background [0002] The use of halogen-free substrates and lead-free solders for printed circuit boards (PCBs) is an inevitable direction for the development of microelectronics manufacturing. In the process of PCB manufacturing and use, multiple reflow soldering and rework processes will cause the interface layer between the PCB pad and the substrate fiber to withstand multiple thermal stresses. In addition, in order to adapt to the lead-free process, the PCB design has also been improved accordingly. These changes not only make the printed circuit board more brittle and more prone to breakage, but also cause the interface layer at the bottom of the PCB pad to withstand higher thermal stress, which is prone to the common phenomenon of PCB pad cratering. As stated ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K1/008B23K3/08
CPCB23K1/008B23K3/087
Inventor 菜苗杨道国李欣锶韩顺枫陈显平张平
Owner GUILIN UNIV OF ELECTRONIC TECH
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