Highly-water-resistant nanometer-material-containing hot melt adhesive for packaging paper

A nanomaterial, packaging paper technology, applied in the direction of adhesives, non-polymer adhesive additives, adhesive types, etc. High and low temperature performance is limited and other problems, to achieve the effect of improving waterproof performance, high bonding strength and good air tightness

Inactive Publication Date: 2015-11-11
QUANJIAO HAIFENG PRINTING PACKAGING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since EVA resin is a thermoplastic resin, it has limited high and low temperature resistance and low softening point, and most of the main auxiliary tackifiers are polymers with small molecular weights, which only reduce the melt viscosity and improve the wettability and initial strength. The role of stickiness, itself is not resistant to high and low temperature, resulting in the shortcomings of EVA hot melt adhesive not resistant to high and low temperature; at the same time, EVA hot melt adhesive also has low bonding performance, not resistant to fat oil, easy to produce skinning and not suitable for large Disadvantages such as area coating and adhesion
[0003] At present, with the rapid development of the PET industry, the amount of discarded PET has also increased, which has brought serious pollution to the environment.

Method used

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Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0019] A high waterproof hot melt adhesive for packaging paper containing nano-materials, which is made from the following raw materials by weight (kg): EVA85, modified tackifying resin 20, dodecyltrimethylammonium chloride 1, rosin Pentaerythritol ester 20, C5 petroleum resin 20, sulfur powder 3, nano calcium carbonate 35, accelerator TMTD1, accelerator TETD2, ferrocene 1, nano silicon dioxide 10, polyethylene wax 10, trioctyl trimellitate 4 , caprolactam 1;

[0020] Described modified tackifying resin is made from the raw material of following weight (kg):

[0021] Waste PET fragments 42, zinc acetate 3, polysulfide rubber 10, neoprene rubber 5, alkyl phenolic resin 20, styrene resin 5, trimethyl octadecyl ammonium chloride 2, carbide slag 10, activated carbon 4;

[0022] The preparation method of described modified tackifying resin is:

[0023] (1) After mixing calcium carbide slag and activated carbon, irradiate with ultraviolet rays for 12 hours, then soak in 8% hydroch...

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Abstract

The invention discloses a highly-water-resistant nanometer-material-containing hot melt adhesive for packaging paper. The hot melt adhesive is prepared from the following raw materials in parts by weight: 85-100 parts of EVA, 10-20 parts of modified tackifying resin, 1-2 parts of dodecyl trimethyl ammonium chloride, 10-20 parts of rosin pentaerythritol ester, 20-30 parts of C5 petroleum resin, 1-3 parts of sulphur powder, 25-35 parts of nano calcium carbonate, 1-2 parts of an accelerant TMTD, 1-2 parts of an accelerant TETD, 1-2 parts of ferrocene, 5-10 parts of nano silica, 10-20 parts of polyethylene wax, 2-4 parts of tri-octyl tri-meta-benzoate and 1-3 parts of caprolactam. Since the hot melt adhesive provided by the invention adopts a novel formula and contains nano-powder, the hot melt adhesive not only has relatively high bonding strength, and in addition, the water resistance of the product namely the hot melt adhesive is improved greatly.

Description

technical field [0001] The invention belongs to the field of adhesives, in particular to a hot-melt adhesive for wrapping paper containing nano-materials with high water resistance. Background technique [0002] EVA hot melt adhesive is formulated from EVA resin, tackifier, plasticizer, antioxidant, filler, etc. In today's society, EVA hot melt adhesives are widely used and used in the largest amount. It has excellent bonding performance, almost has thermal adhesion to various materials; excellent electrical properties; and its low melt viscosity, convenient sizing; good compatibility with other compounding agents, etc. EVA hot melt adhesives have been widely used in many fields such as book binding, food packaging, plastic bonding, ceramic repairing, mounting, clothing, shoes and hats molding, automobiles and building materials. Since EVA resin is a thermoplastic resin, it has limited high and low temperature resistance and low softening point, and most of the main auxili...

Claims

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Application Information

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Patent Type & AuthorityApplications(China)
IPC IPC(8): C09J123/08C09J193/04C09J157/02C09J123/06C09J167/02C09J181/04C09J111/00C09J161/06C09J125/06C09J11/04C09J11/06
Inventor毕全中
OwnerQUANJIAO HAIFENG PRINTING PACKAGING