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Method for manufacturing semiconductor refrigerating device

A manufacturing method and semiconductor technology, applied in the manufacture/processing of thermoelectric devices, thermoelectric device parts, etc., can solve the problems of poor welding of crystal grains and porcelain plates, undurable products, and falling off of grains, etc. Not easy to fall off, good effect, strong welding effect

Inactive Publication Date: 2015-11-11
HENAN HONGCHANG ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the prior art, the crystal grains are directly welded on the metallized layer of the porcelain plate, and the semiconductor refrigeration parts made in this way have the problems that the grains and the porcelain plate are not welded firmly, the grains are easy to fall off from the porcelain plate, and the product cannot Disadvantages of durability and easy damage

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0014] The crystal grains are directly welded on the porcelain plate to make the first semiconductor refrigerator product A.

[0015] Fix the first semiconductor refrigerator product A, pull the puller, and the force of 190 Newtons can separate the crystal grains from the porcelain plate.

Embodiment 2

[0017] First, coat a layer of aqueous solution of lanthanum oxide on the porcelain plate, dry it, and control the thickness of the lanthanum oxide to 1 wire, and directly weld the crystal grains on the porcelain plate to make the second semiconductor refrigerator product B.

[0018] Fix the second semiconductor refrigerator product B and pull the pulling member, and the force of 280 Newtons can separate the crystal grains from the porcelain plate.

Embodiment 3

[0020] First, coat a layer of aqueous solution of lanthanum oxide on the porcelain plate, dry it, and control the thickness of the lanthanum oxide to 3 wires, and directly weld the crystal grains on the porcelain plate to make the third semiconductor refrigerator product C.

[0021] Fix the third semiconductor refrigerator product C, pull the pulling member, and the force of 260 Newtons can separate the crystal grains from the porcelain plate.

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PUM

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Abstract

The invention relates to the technical field of manufacturing of refrigerating devices, and provides a method for manufacturing a semiconductor refrigerating device. The semiconductor refrigerating device comprises a porcelain plate and semiconductor crystalline grains, wherein a metalization layer is arranged on the porcelain plate; the semiconductor crystalline grains are welded on the porcelain plate; a layer of lanthanum metal compound is also arranged on the metalization layer; the lanthanum metal compound is lanthanum oxide, lanthanum carbonate or lanthanum nitrate; the thickness of the layer of lanthanum metal compound is 1-3 yarns; and the thickness of the layer of lanthanum metal compound is 2 yarns, so that the manufactured semiconductor refrigerating device has the advantage of being firm to weld, durable and not easy to damage; and the crystalline grains are not easy to fall off.

Description

technical field [0001] The invention relates to the technical field of refrigerating parts manufacturing, in particular to a method for manufacturing a semiconductor refrigerating part. Background technique [0002] Semiconductor refrigeration parts include porcelain plates and semiconductor grains. The semiconductor grains are welded on the porcelain plate. The main component of the porcelain plate is 95% alumina, which plays the role of electrical insulation, heat conduction and support. There is a layer of In the metallization layer, the main component of the grain is bismuth telluride, which is the main functional part of the refrigeration component, and the grain is welded on the metallization layer of the porcelain plate by tin. [0003] In the prior art, the crystal grains are directly welded on the metallized layer of the porcelain plate, and the semiconductor refrigeration parts made in this way have the problems that the grains and the porcelain plate are not welde...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L35/08H01L35/34H10N10/817H10N10/01
Inventor 陈磊刘栓红赵丽萍张文涛蔡水占郭晶晶张会超陈永平王东胜惠小青辛世明田红丽
Owner HENAN HONGCHANG ELECTRONICS