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Metal part electroplating method

A technology of metal parts and electroplating copper, which is applied in the field of electroplating, can solve the problems that hydrogen embrittlement cannot be completely eliminated, and achieve the effects of avoiding hydrogen embrittlement, avoiding waste, and increasing bonding force

Inactive Publication Date: 2015-11-18
WUXI QIAOYANG MACHINERY MFG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The above two methods cannot completely eliminate hydrogen embrittlement, but can only reduce hydrogen embrittlement to a certain extent

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] A method for electroplating metal parts, comprising the steps of:

[0025] a. sticking film, covering one deck on the surface of the metal part to be electroplated with an anti-plating film that overlaps with the part that does not need to be electroplated; the anti-electroplating film is a photosensitive film or adhesive tape, and the present embodiment is preferably an anti-electroplating film; the photosensitive film is covered on the metal part to be electroplated On the metal piece; use an exposure machine to expose the part of the metal piece that does not need electroplating; develop the unexposed part of the photosensitive film to form an anti-plating area on the surface of the metal piece.

[0026] b. electroplating, electroplating copper, electroplating nickel and electrogalvanizing respectively to the metal parts covered with the electroplating film on the surface, wherein, the electroplating solution of electroplating zinc consists of sodium hydroxide of 10mg...

Embodiment 2

[0031] A method for electroplating metal parts, comprising the steps of:

[0032] a. sticking film, covering one deck on the surface of the metal part to be electroplated with an anti-plating film that overlaps with the part that does not need to be electroplated; the anti-electroplating film is a photosensitive film or adhesive tape, and the present embodiment is preferably an anti-electroplating film; the photosensitive film is covered on the metal part to be electroplated On the metal piece; use an exposure machine to expose the part of the metal piece that does not need electroplating; develop the unexposed part of the photosensitive film to form an anti-plating area on the surface of the metal piece.

[0033] b. electroplating, electroplating copper, electroplating nickel and electrogalvanizing respectively to the metal parts covered with the electroplating film on the surface, wherein, the electroplating solution of electroplating zinc consists of sodium hydroxide of 130m...

Embodiment 3

[0038] A method for electroplating metal parts, comprising the steps of:

[0039] a. sticking film, covering one deck on the surface of the metal part to be electroplated with an anti-plating film that overlaps with the part that does not need to be electroplated; the anti-electroplating film is a photosensitive film or adhesive tape, and the present embodiment is preferably an anti-electroplating film; the photosensitive film is covered on the metal part to be electroplated On the metal piece; use an exposure machine to expose the part of the metal piece that does not need electroplating; develop the unexposed part of the photosensitive film to form an anti-plating area on the surface of the metal piece.

[0040]b. electroplating, electroplating copper, electroplating nickel and electrogalvanizing respectively to the metal parts covered with the electroplating film on the surface, wherein, the electroplating solution of electroplating zinc consists of sodium hydroxide of 150mg...

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Abstract

The invention discloses a metal part electroplating method. The metal part electroplating method includes the steps that a, film pasting is conducted, i.e., the surface of a metal part to be electroplated is covered with an anti-electroplating film coinciding with the portion, not needing electroplating, of the metal part; b, electroplating is conducted, i.e., the metal part with the surface covered with the anti-electroplating film is subjected to electrocoppering, electronickelling and electrogalvanizing, wherein an electrogalvanizing solution for electrogalvanizing is composed of 100-150 mg / L of sodium hydroxide, 5-10 mg / L of ethylenediamine, 25-30 mg / L of triethanolamine, 50-130 mg / L of alkaline tetra-iso-propyl amine, 10-15 mg / L of zinc sulfate, 40-59 mg / L of sodium citrate, 25-39 mg / L of phosphorous acid, 40-55 mg / L of dioctyl sodium sulfosuccinate and 25-67 mg / L of antimony potassium tartrate, and meanwhile electroplating parameters are set; and c, film removal is conducted, i.e., the anti-electroplating film on the metal part is removed after electroplating is completed. By means of the metal part electroplating method, the electroplating cost is reduced and the occurrence rate of hydrogen brittleness is also reduced.

Description

technical field [0001] The invention relates to an electroplating method, in particular to an electroplating method for metal parts. Background technique [0002] In the prior art, integral electroplating ( Including gold plating, silver plating, copper plating, etc.), but in practical applications, only part of most metal parts need to be electroplated. This overall electroplating method also electroplates the parts that do not need to be electroplated, resulting in unnecessary Necessary waste, and when the electroplating layer on the surface of metal parts is to be bonded and joined with other parts or PCBs, the bonding force is relatively poor (especially gold-plated parts), and it is easy to produce delamination at high temperatures. [0003] In addition, the anti-corrosion of metal parts is generally galvanized on the surface, but it is prone to hydrogen embrittlement. Hydrogen embrittlement can cause metal fasteners to break after being locked for a period of time or...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D5/02C25D5/12C25D3/22
Inventor 沈秋
Owner WUXI QIAOYANG MACHINERY MFG
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