Micro-nano copper wire and preparation method thereof

Abstract

The invention provides a micro-nano copper wire and a preparation method thereof. The preparation method comprises the following steps of 1) providing a substrate, forming a flexible material layer on the surface of the substrate, and forming a plurality of groove structures on the surface of the flexible material layer; 2) forming a seed layer in each groove structure; 3) filling inside of each groove structure with a conductive copper material by means of electroplating or chemical plating. The invention has the beneficial effects that, in the aspect of wire width spacing variation, as compared with the past addition process, the method provided by the invention can limit lateral deposition of copper in the structure of a UV adhesive, thus, variation of the width of the copper wire is guaranteed to be very small; in the aspect of economic cost, as compared with the conventional copper etching method or a silver paste printing mode, the method provided by the invention can reduce complex production procedures, reduce usage of raw materials and greatly reduce wastewater discharge, thereby having great environmental protection and economic benefits. Moreover, the electroplating or the chemical plating provided by the invention has extremely low cost and low waste in procedures, and has the advantage of coil-to-coil production.

Description

technical field [0001] The invention relates to the field of micro-nano copper wire manufacturing, in particular to a micro-nano copper wire structure and a preparation method thereof. Background technique [0002] Micro-nano copper wires are widely used in many fields such as electronic materials, conductive materials, and catalytic materials. At present, the preparation of micro-nano copper wires mostly adopts the additive method and the traditional printed copper wire method. [0003] Such as figure 1 As shown, the additive method is to first coat a layer of seed layer ink on the base material by sputtering or printing, usually special ink or silver paste, and then use electroplating or electroless plating to plate metal on the seed layer ink. Copper to prepare conductive copper wire. However, the traditional addition method is used to prepare micro-nano copper wires. Since there is no restriction on the lateral direction of copper when electroplating copper paste, the ...

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Problems solved by technology

[0009] In view of the shortcomings of the prior art described above, the purpose of the present invention is to provide a micro-nano copper wire structure and a preparation method thereof, which are used to solve the problem of difficult control of the line width or complicated process of the preparation of the micro-nano copper wire structure in the prior art, Serious material waste and high cost

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