Miniature four-channel circular flow type triaxial silicon jet gyro

Abstract

The application exposes a miniature four-channel circular flow type triaxial silicon jet gyro; the jet gyro comprises a four-channel circular flow type triaxial angular velocity sensitive element and a PCB, and the sensitive element is electrically connected with the PCB, wherein the sensitive element comprises a PMMA upper cover, an upper silicon board, a lower silicon board, a PMMA bottom cover and a piezoelectric ceramic round oscillator; the piezoelectric ceramic round oscillator is embedded in the PMMA upper cover; the upper silicon board is provided with a jet network; the lower silicon board is provided with a jet network and a hot line; the PMMA upper cover, the upper silicon board, the lower silicon board and the PMMA bottom cover are successively bonded to form the sensitive element. The jet gyro adopts one piezoelectric ceramic round oscillator to drive four-channel circular flow, not only is simple in structure, long in life and low in power consumption, and implements deformation direction of the piezoelectric ceramic round oscillator and direction turning of jet flow network planes; the area of the piezoelectric ceramic round oscillator is large, the driving ability is strong, the jet velocity is high, and the jet gyro sensitivity is high; and angular velocities of three orthogonal directions can be sensitive at the same time, and multi-axis integration is achieved.

Description

technical field [0001] The invention belongs to the technical field of using Coriolis force to deflect a jet sensitive body to detect the angular velocity attitude parameters of a moving body, in particular to a miniature four-channel circulation flow type three-axis silicon jet gyroscope. Background technique [0002] At present, the sensitive elements of micro-gyroscopes represented by micro-mechanical vibrating gyroscopes are composed of vibrating parts with different structures, which are not only easily broken or damaged under slightly high acceleration shocks, but also require vacuum packaging in order to reduce damping during the manufacturing process. Complex, causing fatigue damage when working for a long time. In contrast, jet gyroscopes do not require vibrating parts, have a simple structure, can withstand high overload, long life and low cost, which are incomparable to other gyroscopes, and have a wider range of applications. Chinese patent 89105999.7 proposes a...

AI Technical Summary

Problems solved by technology

Chinese patent 89105999.7 proposes a high-sensitivity piezoelectric jet angular velocity sensor (a jet gyroscope), which consists of a sensitive device housing, a nozzle body, a sensitive element, a piezoelectric pump, a pump seat, a disc spring, a lock nut and an external circuit System and mechanical system, the sensitive element of this one-dimensional angular velocity sensor is made of copper, aluminum or stainless steel and other materials using traditional machining, the sensitive element is large in size and high in power, and cannot be used in the field of micro-carrier attitude measurement and control. The hot wires are manually soldered, it is difficult to ensure the parallelism and perpendicularity of the hot wires, so the cross-coupling is large, the consistency is poor, it is difficult to mass produce, and the cost is high

In the prior art, silicon wafers are usually used to make jet networks using MEMS technology to etch airflow channels on the surface of a silicon wafer. Since the thickness of the silicon wafer is only about 500 μm, the depth of the jet network must be smaller than the thickness of the silicon wafer. Therefore, the jet network The size of the gyro is very small, the gas capacity is small, the heat exchange with the hot wire is small, the sensitivity of the gyro will be very small, and it cannot be practical

In the prior art, when the piezoelectric pump drives the gas flow on the silicon wafer, the effective deformation area of ​​the piezoelectric pump vibrator corresponds to the cross-sectional area of ​​the gas flow channel, so that the deformation direction (vibration direction) of the piezoelectric pump vibrator is along the silicon wafer. The transverse direction of the wafer (the direction of the cross-sectional area perpendicular to the surface of the silicon wafer) is consistent with the length direction of the airflow channel, so the size of the piezoelectric pump vibrator is often smaller than 1×1mm, which is difficult to achieve bonding in the actual process, and because The size of the piezoelectric pump vibrator is too small, the ability to drive gas is weak, the airflow speed is small, and the gyro sensitivity is small

In the prior art, it is difficult to realize the manufacture of three-dimensional heating wires (thermistors) on silicon wafers using MEMS technology, and it is also difficult to form three-dimensional jet sensitive bodies. It can be sensitive to the angular velocity in one direction. If the multi-degree-of-freedom measurement needs to be installed in combination, the error caused by the installation distance is large and the cost is high.

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