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Infrared shielding filter, solid-state imaging element, and imaging/display device

A technology for shielding filters and infrared rays, which is applied in the direction of electric solid devices, electrical components, optical components, etc. It can solve the problems of reduced product yield, increased number of resulting processes, foreign objects, etc., and achieve the effect of high transmittance

Active Publication Date: 2015-12-02
ASAHI GLASS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in this case, the thickness of the device cannot be met, such as the above-mentioned thinning requirements of the digital camera.
In addition, it is also possible to extend the shielded wavelength region caused by the dielectric multilayer film to a long wavelength region exceeding 1200 nm, but the number of laminations and the total film thickness must be increased, resulting in an increase in the number of steps, and there is also a problem of adhesion to the film during film formation. The problem of foreign matter on the surface, the reduction of product yield, the increase of manufacturing cost and other issues

Method used

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  • Infrared shielding filter, solid-state imaging element, and imaging/display device
  • Infrared shielding filter, solid-state imaging element, and imaging/display device
  • Infrared shielding filter, solid-state imaging element, and imaging/display device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0200] In a 15% by mass cyclohexanone solution of a polyester resin (trade name B-OKP2 manufactured by Osaka Gas Chemicals Co., Ltd.), the dithiolane complex represented by the formula (F1-6) (dissolved in toluene and measured in the wavelength region In the absorption spectrum of light from 700 to 1300nm, λ max for 1168nm, the λ maxThe absorbance is 1, and the absorbance is 0.2, and the shortest wavelength is 891nm) Mixed at a ratio of 4.0 parts by mass of the disulfide complex to 100 parts by mass of the polyester resin, stirred well to dissolve, and prepared coating solution A .

[0201] In a 50% by mass tetrahydrofuran solution of an acrylic resin (trade name OGSOLEA-F5003 manufactured by Osaka Gas Chemicals Co., Ltd.), a squarylium dye (λmax=697 nm (toluene)) represented by the following formula was added to 100 parts by mass of the acrylic resin. The acid cyanine dye was mixed in a ratio of 0.25 parts by mass, stirred sufficiently to dissolve, and a coating solution B ...

Embodiment 2

[0208] Coating liquid A and coating liquid B were prepared similarly to Example 1.

[0209] The coating solution A was applied to one main surface of the glass substrate by a die coating method, and after drying at room temperature for 5 minutes under reduced pressure (about 670 Pa), it was heated at 90° C. for 30 minutes. After repeating the steps from coating to heating again, heating was performed at 150° C. for 15 minutes to form an infrared absorbing layer A having a thickness of 10.8 μm. As the glass substrate, a substrate made of soda glass (manufactured by SCHOTT, trade name D263) having a thickness of 1.0 mm was used.

[0210] Next, on the above-mentioned infrared absorbing layer A, silicon dioxide (SiO 2 ; Refractive index 1.45 (wavelength 550nm)) layer and titanium dioxide (TiO 2 ; Refractive index 2.32 (wavelength 550nm)) layer, form the dielectric multilayer film A (42 layers) that is formed by the composition shown in Table 1.

[0211] Next, the coating liquid...

Embodiment 3

[0214] In the absorption spectrum measured using the disulfide compound (dissolved in toluene) shown in formula (F1-7), λ max for 1170nm, the λ max The absorbance is 1, and the absorbance is 0.2, and the shortest wavelength is 966 nm) instead of the disulfide compound shown in the formula (F1-6), the coating solution A is prepared in the same manner as in Example 1. cloth liquid.

[0215] This coating solution was applied to one main surface of a glass substrate by a die coating method, dried at room temperature for 5 minutes under reduced pressure (about 670 Pa), and then heated at 90° C. for 30 minutes. After repeating the steps from this application to heating again, it was heated at 150° C. for 15 minutes to form an infrared absorbing layer with a thickness of 4.7 μm. As the glass substrate, a substrate made of CuO-containing fluorophosphate glass (manufactured by AGC Techno Glass Co., Ltd., trade name NF-50T) having a thickness of 0.35 mm was used.

[0216] Next, silic...

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Abstract

An infrared shielding filter is provided with an infrared absorption layer formed from a transparent resin that includes infrared absorbing bodies and a selective wavelength shielding layer laminated on this infrared absorption layer, and satisfies the following requirements. (i) In a spectral transmittance curve for an incident angle of 0°, an average transmittance of 80% or greater for wavelengths of 450 - 600 nm, a transmittance of 2.0% or less for wavelengths of 700 - 1200 nm, and transmittance variation D0 given by the following equation of less than 0.04, D0(% / nm) = (Tmax∙0 − Tmin∙0) / (λ(Tmax∙0) − λ(Tmin∙0)) (ii) In a spectral transmittance curve for an incident angle of 30°, an average transmittance of 80% or greater for wavelengths of 450 - 600 nm, a transmittance of 2.0% or less for wavelengths of 700 - 1200 nm, and transmittance variation D30 given by the following equation of less than 0.04. D30(% / nm) = (Tmax∙30 − Tmin∙30) / (λ(Tmax∙30) − λ(Tmin∙30))

Description

technical field [0001] The present invention relates to an infrared shielding filter, a solid-state imaging device and an imaging / display device using the infrared shielding filter. Background technique [0002] In recent years, infrared shielding filters that transmit light in the visible wavelength range (420 to 630 nm) and block light in the near infrared wavelength range (700 to 1100 nm) have been used in various applications. [0003] For example, digital cameras, digital video, mobile phone cameras and other imaging devices using solid-state imaging elements such as CCD (Charge Coupled Device, Charge Coupled Device), CMOS image sensor (Complementary Metal Oxide Semiconductor Image Sensor, Complementary Metal Oxide Semiconductor Image Sensor), etc., use light receiving elements Conventionally, display devices such as automatic illuminance meters have spectral sensitivity ranging from the visible light wavelength region to the near-infrared wavelength region near 1100 nm...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02B5/28C09B57/10C09K3/00G02B5/22H01L27/14H04N5/238H04N9/07H04N23/12H04N23/75
CPCC09B57/10C09B49/12G02B5/223G02B5/281G02B5/208G03B11/00
Inventor 山本今日子村上贵章馆村满幸熊井裕
Owner ASAHI GLASS CO LTD
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