Copper clad laminate with low dielectric constant and manufacturing method of copper clad laminate

Abstract

The invention relates to a copper clad laminate with a low dielectric constant and a manufacturing method of the copper clad laminate, and belongs to the technical field of the copper clad laminate. A method for acquiring cristobalite with alkali resistance and the low dielectric constant is provided, composition of a resin mixture of the copper clad laminate is improved, and the copper clad laminate with the low dielectric constant is obtained. The problem of a method for acquiring the low dielectric constant by the aid of modified resin or resin with the low dielectric constant all the time is solved, inorganic filler with the low dielectric constant is added more economically and more conveniently, and specifically, the method for reducing the dielectric constant of the copper clad laminate by adopting cristobalite powder prepared from vein quartz ore as inorganic filler composition is provided.

Description

technical field [0001] The invention relates to the technical field of copper-clad laminates, in particular to a copper-clad laminate with a low dielectric constant used in the high-frequency communication industry. Background technique [0002] With the rapid development of electronic science and technology, the information processing of electronic products such as mobile communications, servers, and large computers continues to develop in the direction of "high-frequency signal transmission and high-speed digitalization". This requires that the laminate substrate (copper-clad laminate) for making printed circuit boards need to have: (1) low dielectric constant and low dielectric loss tangent to meet the requirements of low loss and high-speed information processing. (2) It has high heat resistance, that is, a high glass transition temperature and excellent thermal stability. [0003] In the prior art, a glass fiber cloth is impregnated with a resin mixture to form a layer...

AI Technical Summary

Problems solved by technology

The problem with the above technical solutions is that the dimensional stability of the produced copper clad laminates is not considered and solved

Ferric oxide and alumina will increase the dielectric constant and dielectric loss due to polarization, so the cristobalite made of natural powder quartz has a high dielectric constant and a large dielectric loss

The well-known alkali and acid will form a salt, and the ionization of the salt into ions is easy to be adsorbed on the surface of the powder quartz. Loss becomes larger

It is also mentioned in the patent document that the process of making cristobalite is to directly calcine at high temperature after drying, and quartz not only has moisture on the surface, but also moisture in its internal gaps. Drying can only dry the surface moisture, and the internal moisture cannot pass through. Drying and exclusion, when directly calcined at high temperature, the quartz will disintegrate because the water quickly turns into steam, and the cristobalite with expansion and voids cannot be formed well

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