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Composite diamond heat-dissipating material and preparing method thereof

A composite heat dissipation material and diamond technology, which is applied in the field of diamond composite heat dissipation materials and its preparation, can solve the problems of poor coating quality and unevenness of heat dissipation materials, and achieve the effects of good compactness, good film quality and simple operation

Inactive Publication Date: 2015-12-09
SOUTH CHINA NORMAL UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of the above deficiencies in the prior art, the object of the present invention is to provide a diamond composite heat dissipation material and its preparation method, reduce the cost of heat dissipation materials and improve the poor quality and unevenness of the heat dissipation material coating

Method used

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  • Composite diamond heat-dissipating material and preparing method thereof

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Effect test

Embodiment 1

[0022] Weigh 150 grams of water-based anionic acrylic resin (solid content about 50%) and 5 grams of defoaming agent; pour it into 450 Form solution A in 1 gram of deionized water (conductivity less than 5us / cm); weigh 1.5 grams of diamond micropowder (particle size W1.5, the same below), 2 grams of carbon nanotubes (length 50um, the same below), and grind evenly After mixing, then use 50 grams of deionized water and 0.3 grams of dispersant to disperse the composite material of diamond and carbon nanotubes to form solution B; then pour solution B into solution A while stirring in ultrasonic hydrothermal to form electrophoresis Liquid C is then poured into the electrophoresis tank; the metal radiator is set as the anode after degreasing, alkali corrosion and other preliminary processes, and the stainless steel plate is set as the cathode, and a 100V DC voltage is applied for 40 seconds; the sample is taken out and washed with deionized water Then put it into a high-temperature ...

Embodiment 2

[0024] Weigh 150 grams of water-based anionic acrylic resin (solid content about 50%) and 5 grams of defoamer, and pour them into 450 grams of deionized water (conductivity less than 5us / cm) while stirring in an ultrasonic hydrothermal environment to form Solution A: Weigh 5 grams of diamond powder, tourmaline powder (particle size 10,000 mesh, the same below), and carbon nanotubes (by weight ratio 1.5:1.5:2) and mix evenly, then use 50 grams of deionized water and 0.4 grams of The dispersant disperses the composite material of diamond, tourmaline and carbon nanotubes to form solution B; then pour solution B into solution A while stirring in ultrasonic hydrothermal to form electrophoretic solution C and pour it into the electrophoresis tank; The radiator is set as the anode after degreasing, alkali etching and other preliminary processes, and the stainless steel plate is set as the cathode, and a DC voltage of 100V is applied for 40 seconds; the sample is taken out, washed with...

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Abstract

The invention discloses a composite diamond heat-dissipating coating material and a preparing method thereof. The heat-dissipating coating material is prepared from a component A and a component B, wherein the component A is a diamond composite material with the heat emission rate larger than 0.93, and the component B is water-based ionic modified resin. The obtained heat-dissipating coating has the advantages of being even, good in compactness and high in decay resistance and heat-dissipating capacity and preventing static, the adopted preparing method has the advantages of being easy to operate, low in cost, high in material use ratio and base body combination degree, good in film forming quality and the like, and the composite diamond heat-dissipating coating material can be widely applied to heat dissipation of the fields such as microelectronic devices and lighting lamps.

Description

technical field [0001] The invention relates to the technical field of paint and surface treatment, in particular to a diamond composite heat dissipation material and a preparation method thereof. Background technique [0002] With the rapid development of modern science and technology, electronic products are developing towards high frequency, high speed, high power, and the density and miniaturization of integrated circuits, which greatly increases the total power density and calorific value of electronic products per unit volume, thus making electronic products The cooling problem of products is becoming more and more prominent. However, the cooling capacity achieved by conventional cooling systems has been greatly challenged, especially in the fields of microelectronics, information, lighting, energy, automobiles, air conditioning, and chemical industry. Require. The heat dissipation coating is a method of enhancing the heat dissipation capacity of the object by increa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D7/12C09D5/44
Inventor 郑树文蓝栩砚章勇何苗
Owner SOUTH CHINA NORMAL UNIVERSITY
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