Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Low-temperature co-fired ceramic material and preparation method thereof

A technology of low-temperature co-fired ceramics and ceramics, which is applied in the field of low-temperature co-fired ceramic materials and their preparation, high-frequency low-dielectric loss low-temperature co-fired ceramic materials and their preparation fields, and can solve the problems of poor device stability, large property changes, and process problems. Narrow windows and other issues, to achieve excellent dielectric properties, low dielectric loss, and reduce the effect of sintering temperature

Active Publication Date: 2015-12-23
NAT UNIV OF DEFENSE TECH
View PDF4 Cites 14 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The glass-ceramic system LTCC material needs to go through the process of nucleation and crystallization, but this process is difficult to completely control, and with the change of heat treatment conditions, its properties change greatly, especially the dielectric loss
Therefore, the main disadvantages of this system are narrow process window, low yield, and poor device stability.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Low-temperature co-fired ceramic material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] A kind of low-temperature co-fired ceramic material of the present invention, this low-temperature co-fired ceramic material is made of La 2 o 3 -B 2 o 3 -Al 2 o 3 Glass-ceramic and Al 2 o 3 Ceramic filling phase composition, wherein, by mass fraction, the La 2 o 3 -B 2 o 3 -Al 2 o 3 glass-ceramic is 60wt%, the Al 2 o 3 The ceramic filling phase is 40 wt%.

[0034] In this example, La 2 o 3 -B 2 o 3 -Al 2 o 3 The mass fraction of each component in the glass-ceramic is: La 2 o 3 20wt%, B 2 o 3 60wt%, Al 2 o 3 is 20wt%.

[0035] In this embodiment, the dielectric constant of the low temperature co-fired ceramic material is 7.85, and the dielectric loss is 4.21×10 -3 , the frequency is 8.65GHz.

[0036] A preparation method of the above-mentioned low temperature co-fired ceramic material of the present embodiment, comprising the following steps:

[0037] (1)La 2 o 3 -B 2 o 3 -Al 2 o 3 Preparation of glass-ceramic powder: 20wt% lanthanum o...

Embodiment 2

[0043] A low temperature co-fired ceramic material of the present invention, comprising 50wt% La 2 o 3 -B 2 o 3 -Al 2 o 3 Glass-ceramic and 50wt% Al 2 o 3 Ceramic filler phase.

[0044] In this example, La 2 o 3 -B 2 o 3 -Al 2 o 3 The mass fraction of each component in the glass-ceramic is: La 2 o 3 22.5wt%, B 2 o 3 67.5wt%, Al 2 o 3 is 10wt%.

[0045] In this embodiment, the dielectric constant of the low temperature co-fired ceramic material is 7.69, and the dielectric loss is 3.24×10 -3 , the frequency is 8.84GHz.

[0046] Concrete operation steps and process parameter of embodiment 2 are basically the same as embodiment 1, and difference is:

[0047] The heat preservation melting temperature in the step (1) is 1200°C.

[0048] The sintering temperature in step (5) is 900°C.

Embodiment 3

[0050] A low temperature co-fired ceramic material of the present invention, comprising 60wt% La 2 o 3 -B 2 o 3 -Al 2 o 3 Glass-ceramic and 40wt% Al 2 o 3 Ceramic filler phase.

[0051] In this example, La 2 o 3 -B 2 o 3 -Al 2 o 3 The mass fraction of each component in the glass-ceramic is: La 2 o 3 22.5wt%, B 2 o 3 65wt%, Al 2 o 3 It is 12.5wt%.

[0052] In this embodiment, the dielectric constant of the low temperature co-fired ceramic material is 7.54, and the dielectric loss is 3.68×10 -3 , the frequency is 8.51GHz.

[0053] Concrete operation steps and process parameter of embodiment 3 are substantially the same as embodiment 1, and difference is:

[0054]The heat preservation melting temperature in the step (1) is 1250°C.

[0055] The sintering temperature in step (5) is 900° C., and the holding time is 1 h.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Frequencyaaaaaaaaaa
Particle sizeaaaaaaaaaa
Frequencyaaaaaaaaaa
Login to View More

Abstract

The present invention discloses a low-temperature co-fired ceramic material and a preparation method thereof, wherein the low-temperature co-fired ceramic material comprises 40-60 wt% of La2O3-B2O3-Al2O3 glass ceramic and 40-60 wt% of an Al2O3 ceramic filling phase. The preparation method comprises: La2O3-B2O3-Al2O3 glass ceramic preparation, Al2O3 ceramic powder pretreatment, composite powder preparation, composite powder molding, and low-temperature sintering. According to the present invention, the low-temperature co-fired ceramic material has advantages of wide process window, low dielectric loss and the like, and can be used in the high frequency field, and the preparation method has characteristics of simpleness, convenience, and low equipment investment.

Description

technical field [0001] The invention belongs to the field of electronic ceramics and its preparation, and relates to a low-temperature co-fired ceramic material and a preparation method thereof, in particular to a high-frequency low-dielectric-loss low-temperature co-fired ceramic material and a preparation method thereof. Background technique [0002] LTCC (Low Temperature Cofired Ceramics, low temperature co-fired ceramics) technology refers to the mixing and casting of ceramic powder and organic binder into a green tape (Green Tape) with precise thickness and density. Paste, precision conductor printing and other processes are used to produce the required circuit patterns, and multiple passive components are embedded in it, then laminated and sintered (sintering temperature is lower than 900 ° C), to make built-in passive components with a three-dimensional circuit structure A new high-density electronic packaging technology. LTCC technology has excellent electronic and ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C03C14/00C04B35/10C04B35/622
Inventor 张为军陈兴宇白书欣刘卓峰
Owner NAT UNIV OF DEFENSE TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com