A composite active interlayer diffusion bonding method for seamless bonding of interstitial carbide or nitride ceramics based on high temperature applications

A technology of nitride ceramics and active intermediate layer, which is applied in the field of composite active intermediate layer diffusion connection, can solve the problems of low joint strength and the inability to form a homogeneous mutual-dissolution joint with a single-layer active metal intermediate layer, so as to save energy and reduce connection temperature , Increase the effect of spreading ability

Active Publication Date: 2018-03-30
HARBIN INST OF TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The present invention is to solve the problem that the single-layer active metal intermediate layer cannot form a homogeneous mutual-dissolution joint and the joint strength is low, and provides a composite active intermediate layer diffusion connection method based on high temperature application to realize the seamless connection of interstitial carbide or nitride ceramics

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  • A composite active interlayer diffusion bonding method for seamless bonding of interstitial carbide or nitride ceramics based on high temperature applications
  • A composite active interlayer diffusion bonding method for seamless bonding of interstitial carbide or nitride ceramics based on high temperature applications

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specific Embodiment approach 1

[0012] Specific Embodiment 1: In this embodiment, a composite active interlayer diffusion connection method based on high-temperature application to realize seamless connection of interstitial carbide or nitride ceramics is carried out according to the following steps:

[0013] 1. Surface cleaning: use two or more types of diamond grinding discs from 500# to 1500# to grind the two ceramic base materials to be connected step by step, and then use two or more types of diamond grinding discs from 1500# to 2000# Among them, two or more types of water-grinding sandpaper are finely ground step by step, and finally the two ceramic base materials to be connected after fine grinding are polished, placed in acetone, ultrasonically cleaned for 15min to 30min, and then placed in absolute ethanol. Ultrasonic cleaning for 10 to 15 minutes, and finally placed in a drying oven to dry, that is, two ceramic base materials after surface cleaning are obtained; wherein the ceramic base materials ar...

specific Embodiment approach 2

[0018] Specific embodiment 2: The difference between this embodiment and specific embodiment 1 is that M in the MCx single-phase ceramic described in step 1 is Ti, Zr, Hf, V, Nb or Ta, and x is: 0.55≤x≤ 1; M in the MNx single-phase ceramics described in step 1 is Ti, Zr, Hf, V, Nb or Ta, and x is: 0.55≤x≤1; in the MNx / MNx composite phase ceramics described in step 1 M is Ti, Zr, Hf, V, Nb or Ta, and x is: 0.55≤x≤1; M in the MCx / MCx composite ceramics described in step 1 is Ti, Zr, Hf, V, Nb or Ta, x is 0.55≤x≤1; in the MNx / MCx multiphase ceramics described in step 1, M in MNx is Ti, Zr, Hf, V, Nb or Ta, x is: 0.55≤x≤1, M in MCx is Ti, Zr, Hf, V, Nb or Ta, and x is: 0.55≤x≤1. Others are the same as in the first embodiment.

specific Embodiment approach 3

[0019] Embodiment 3: This embodiment differs from Embodiment 1 or Embodiment 2 in that: the water-abrasive paper described in step 1 is silicon carbide water-abrasive paper or alumina water-abrasive paper. Others are the same as in the first or second embodiment.

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Abstract

A composite active intermediate layer diffusion connection method based on high temperature application to realize seamless connection of interstitial carbide or nitride ceramics, the invention relates to a composite active intermediate based on high temperature application to realize seamless connection of interstitial carbide or nitride ceramics layer diffusion connection method. The present invention aims to solve the problem that the single-layer active metal middle layer cannot form a homogeneous mutual-dissolution joint, and the method is as follows: 1. Surface cleaning; 2. Presetting the active metal layer; When the present invention adopts Ti / Zr / Ti composite active metal as the intermediate layer to connect ZrC ceramics, under the connection condition of 1400°C / 1h / 20MPa, the joint structure is only a solid solution of ZrC and TiC, and the joint shear strength is 240MPa, and Compared with the joint obtained by the single-layer active metal interlayer, the joint strength is increased by 26%; compared with the traditional method, the joint strength is increased by nearly 2.5 times. The invention is applied to the field of brazing.

Description

technical field [0001] The invention relates to a composite active intermediate layer diffusion connection method for realizing seamless connection of interstitial carbide or nitride ceramics based on high temperature application. Background technique [0002] Transition metal carbide or nitride ceramics MCx or MNx (TiC, ZrC, and HfC, etc. or TiN, Zr3N4, etc.) have high melting points (almost all above 3000 ° C), high hardness, low coefficient of thermal expansion, and wear and corrosion resistance Excellent performance such as good performance has been considered as the most promising ceramic material under ultra-high temperature conditions (such as supersonic aircraft, next-generation rocket engines and air-cooled fast reactors, etc.). However, these ultra-high temperature ceramic components usually need to be connected with metals or themselves in practical applications, so connection is an essential link in the manufacturing process of these ultra-high temperature cerami...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C04B37/00
Inventor 何鹏林铁松潘瑞
Owner HARBIN INST OF TECH
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