A wafer bonding method
A wafer and bonding technology, which is applied in the photoengraving process of the pattern surface, the process for producing decorative surface effects, and decorative arts, etc. The effect of avoiding cracking, improving yield and improving effectiveness
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[0043] A specific embodiment is listed: this embodiment is only an embodiment of the present invention, and is not intended to specifically limit the present invention.
[0044] Such as Figure 2a As shown, two wafers to be bonded are provided. Here, for the convenience of description, the two wafers are respectively referred to as a first wafer and a second wafer.
[0045] Such as Figure 2b As shown, first, the bonding layers of the two wafers are bonded to each other. That is, the bonding layer of the first wafer is bonded and connected to the bonding layer of the second wafer.
[0046] Such as Figure 2c As shown, thinning treatment is performed on the surface of the first wafer at the upper end to remove the silicon deposition layer with a predetermined thickness. At the same time, during the thinning process, a retracted incision chamfer is produced on the bonding layer. The retracted type The shape of the notch chamfer is different due to the different processes use...
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