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Aldehyde-free liquid glue and artificial board processing method

A processing method and adhesive technology, applied in the direction of adhesives, inorganic adhesives, manufacturing tools, etc., can solve problems such as poor bonding strength and waterproof performance, failure to form automated production, and high price, so as to simplify the processing process and improve market competition. The effect of strong power and low price

Active Publication Date: 2016-02-03
佛山市乐居轻钢房屋有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

These adhesives have their own advantages and disadvantages: bean glue is cheap, but its bonding strength and waterproof performance are poor; MDI series adhesives have good bonding strength, but are expensive and difficult to handle when used; The bonding strength is good and the price is not expensive. However, in mass production, automatic production has not yet been formed so far, resulting in low efficiency

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] The formaldehyde-free liquid adhesive described in the embodiment of the present invention is a liquid adhesive used to manufacture plywood, and is formulated from 4000 grams of magnesium chloride solution, 4000 grams of magnesium oxide powder with a purity of more than 85% and 24 grams of catalyst; wherein, the The Baume degree of magnesium chloride solution is about 21°, which is formed by fully stirring and mixing 1000 grams of magnesium chloride (or halogen sheet) with a purity of 99% and 3000 grams of water; pour the catalyst into the mixed glue of magnesium chloride solution and magnesium oxide powder The liquid is fully stirred evenly to form the aldehyde-free liquid adhesive.

[0022] When using the formaldehyde-free liquid adhesive described in the first embodiment to manufacture plywood, it can be directly applied to existing wood-based panel processing machinery and equipment, specifically including the following processes:

[0023] (1) Apply the above-mentio...

Embodiment 2

[0027] The formaldehyde-free liquid adhesive described in the embodiment of the present invention is a liquid adhesive used to manufacture particleboard, and is formulated by 8000 grams of magnesium chloride solution, 8000 grams of magnesium oxide powder with a purity of more than 85% and 80 grams of retarder; wherein, The Baume degree of described magnesium chloride solution is about 21 °, is that 45% magnesium chloride (or halogen sheet) and the water of 4000 grams are fully stirred and mixed to form by the purity of 4000 grams; Pour retarder into magnesium chloride solution and magnesium oxide In the mixed glue solution of the powder, fully stir evenly to form the said formaldehyde-free liquid adhesive.

[0028] When the aldehyde-free liquid adhesive described in this embodiment 2 is used to manufacture particleboard, it can also be directly applied to existing wood-based panel processing machinery and equipment. Taking the particleboard with three-layer structure as an exam...

Embodiment 3

[0033] The formaldehyde-free liquid adhesive described in the embodiment of the present invention is a liquid adhesive used for manufacturing fiberboards, and is prepared from 10,500 grams of magnesium chloride solution and 10,500 grams of magnesium oxide powder with a purity of more than 85%; wherein, the wave of the magnesium chloride solution The degree of beauty is about 23°, and it is formed by fully stirring and mixing 3000 grams of magnesium chloride (or halogen flakes) with a purity of 99% and 7500 grams of water; fully stirring and mixing the magnesium chloride solution and magnesium oxide powder, that is, the formation of the magnesium chloride solution. Aldehyde liquid adhesive.

[0034] When using the aldehyde-free liquid adhesive described in this embodiment three to manufacture fiberboard, it can also be directly applied to existing wood-based panel processing machinery and equipment, specifically including the following processes:

[0035] (1) Fully stir the woo...

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Abstract

The invention relates to aldehyde-free liquid glue and an artificial board processing method. The liquid glue is prepared by mixing and blending an magnesium chloride aqueous solution and magnesium oxide powder, serving as inorganic materials, according to the ratio of 1: 1; the magnesium chloride aqueous solution is prepared from magnesium chloride powder or halogen pieces and water according to the ratio of 1: 1 to 1: 3, and the purity of the magnesium chloride powder or the halogen pieces is 45% to 99%. Therefore, the liquid glue does not contain formaldehyde, also has favorable gluing strength, is low in price and can also be directly applied to existing mechanical equipment to process artificial boards, without adding or transforming original mechanical equipment, and also without changing an operation mode of longtime habit. The liquid glue is easily accepted by artificial board manufacturers, high in market competitiveness and easily promoted and sold; in addition, when the liquid glue is used for manufacturing the artificial boards, the artificial boards can be directly subjected to hot pressing after coated with the aldehyde-free liquid glue, without undergoing cold pressing, so that the processing procedures are simplified, the production efficiency is high, and meanwhile, the hot pressing temperature is relatively low, the energy consumption is reduced and the production cost is lower.

Description

technical field [0001] The invention belongs to the technical field of adhesives and wood-based panels, and in particular relates to an aldehyde-free liquid adhesive and a wood-based panel processing method. Background technique [0002] With the rise of human economic development and environmental awareness, regulations and requirements for formaldehyde emission of various wood-based panels (including plywood, particleboard, fiberboard and blockboard) around the world, especially in developed countries and developing countries, are becoming more and more serious. Therefore, relevant experts and scholars are also trying to develop various low-formaldehyde or zero-formaldehyde wood-based panel manufacturing methods and related adhesives. [0003] As we all know, most of the synthetic resin glues (such as urea-formaldehyde resin, melamine resin and phenolic resin) used in the manufacture of multi-layer plywood, particleboard, fiberboard and other wood-based panels for decades ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J1/00B27D1/08B27N1/02B27N3/10
Inventor 简瑞聪
Owner 佛山市乐居轻钢房屋有限公司
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