54results about How to "Hot pressing temperature is low" patented technology

The invention belongs to the technical fields of macromolecule materials and biomedical engineering, in particular to a method for constructing a composite structure tissue engineering bracket containing different extracellular matrixes. The method comprises the following steps: preparing a blood vessel bracket by an electrostatic spinning method; preparing a poriferous bracket part by adopting a blend of polylactic acid and polycaprolactone through a hot-pressing and salting-out method; and introducing the blood vessel bracket into the poriferous bracket. The composite structure tissue engineering bracket constructed in the invention realizes that different extracellular matrixes are constructed in a same bracket.

The invention relates to a preparation method of a bio oil-phenol-methanal copolycondensation resin wood adhesive, belonging to the technical field of fine chemistry and high polymer materials, which comprises the following steps of filtering and refining bio oil to prepare the refined bio oil; adding sulfur and sodium hydroxide solution to the refined bio oil; stirring, heating and reacting to prepare the modified bio oil; and adding phenol and a catalyst to the modified bio oil to prepare the adhesive after reacting. In the method of the invention, the bio oil is taken as a substrate to synthesize the adhesive for wood, and the content of the bio oil is 50 to 60% of the total content of the adhesive. The prepared adhesive has the advantages of high mechanical strength, good waterproof performance and aging resistance, and can be used for preparing the products in high accessories of outdoor stage plywood, particle boards, fiberboards, layer base materials and the like. Moreover, thepreparation technology for pyrolyzing the bio oil wood adhesive is simple and fast, and the resins have the advantages of strong adhesion performance and long storage life.

The invention relates to aldehyde-free liquid glue and an artificial board processing method. The liquid glue is prepared by mixing and blending an magnesium chloride aqueous solution and magnesium oxide powder, serving as inorganic materials, according to the ratio of 1: 1; the magnesium chloride aqueous solution is prepared from magnesium chloride powder or halogen pieces and water according to the ratio of 1: 1 to 1: 3, and the purity of the magnesium chloride powder or the halogen pieces is 45% to 99%. Therefore, the liquid glue does not contain formaldehyde, also has favorable gluing strength, is low in price and can also be directly applied to existing mechanical equipment to process artificial boards, without adding or transforming original mechanical equipment, and also without changing an operation mode of longtime habit. The liquid glue is easily accepted by artificial board manufacturers, high in market competitiveness and easily promoted and sold; in addition, when the liquid glue is used for manufacturing the artificial boards, the artificial boards can be directly subjected to hot pressing after coated with the aldehyde-free liquid glue, without undergoing cold pressing, so that the processing procedures are simplified, the production efficiency is high, and meanwhile, the hot pressing temperature is relatively low, the energy consumption is reduced and the production cost is lower.

The invention discloses preparation of a high-heat-conductive nano fluid adhesive and an application thereof in production of artificial boards. The adhesive includes, by mass, 1-15% of high-heat conductivity metal nano particles, metal oxide nano particles or non-metal nano particles, 83-98.8% of an adhesive for production of a fiber board or a particle board, 0.1-1% of a surfactant or a dispersant, and 0.1-1% of a defoamer, all the components are mixed and are subjected to supersonic vibration to form the adhesive. The invention also discloses a preparation method of the adhesive and an application thereof in production of the artificial boards. The high-heat-conductive nano fluid adhesive has the character that the heat conductivity is significantly increased, so that the adhesive can significantly increase drying speed of the fibers and wood particles after application of the adhesive during production of the fiber board or the particle board, and meanwhile, can significantly reduce hot-pressing time or reduce the hot-pressing temperature of the fiber board or the particle board.

The invention relates to non-formaldehyde recombined laminated wood and a manufacture method thereof. The non-formaldehyde recombined laminated wood is formed by a scrimber veneer strip and an adhesive layer. The scrimber veneer strip is formed through diametral plane splicing and chord plane gluing, the scrimber veneer strip comprises recombination bamboo and recombination wood, during the diametral plane splicing process, the adhesive arranged on the adhesive layer is a polyvinyl acetate emulsion adhesive or an aqueous high-molecular isocyanate adhesive, and during the chord plane gluing process, the adhesive arranged on the adhesive layer is an isocyanate adhesive. With respect to the non-formaldehyde recombined laminated wood, non-aldehyde adhesives are employed, during the diametral plane splicing process, the polyvinyl acetate emulsion adhesive (white emulsion) or the aqueous high-molecular isocyanate adhesive is employed, and during the chord plane gluing process, the isocyanate adhesive is employed, the formaldehyde release amount of the non-formaldehyde recombined laminated wood is far lower than 1.5 mg/L which is prescribed in the national standard E1 grade, and the non-formaldehyde aim is achieved.

The invention discloses a novel hot-melt adhesive and a preparation method thereof, particularly a novel hot-melt adhesive suitable for bonding and compounding metals and ABS (acrylonitrile-butadiene-styrene) plastics and a preparation method thereof. The invention is mainly characterized in that the novel hot-melt adhesive comprises the following raw materials in percentage by mass: 45-50% of nylon type copolyamide, 34-37% of thermoplastic polyurethane, 0.3-1% of epoxy compatilizer, 10-15% of tackifier, 1-5% of filler and 0.1-0.3% of antioxidant. The preparation method comprises the following steps: selecting raw materials according to specific percents, carrying out polymerization reaction to form the nylon type copolyamide with favorable bonding properties for metals, and proportionally carrying out blend melting and extrusion on the nylon type copolyamide, thermoplastic polyurethane and the other auxiliary materials under the synergistic action of the specific compatilizer, thereby obtaining the novel hot-melt adhesive with favorable bonding properties for metals and ABS plastics. The product disclosed by the invention satisfies the demands, is simple in technique, and is convenient for industrial production and application.

The invention relates to a standard abrasion piece suitable for petroleum drilling stratum rock abrasivenesss detection. The standard abrasion piece is characterized by adopting a mini-type coring bit structure comprising a grinding component and a steel connecting component, wherein the grinding component comprises a phenolic resin base material and an artificial polycrystalline diamond grinding material; the standard abrasion piece is integrally formed via sintering according to a hot pressing technology, and is connected onto the spindle of a test device via the steel connecting component after being machined and trimmed. The standard abrasion piece has the benefits that the wear resisting property is reasonable; the self-sharpening property is excellent; rock can be drilled effectively; moreover, own abrasion of the standard abrasion piece reflects the abrasion of a diamond bit during a practical well drilling process; the structural is small and exquisite; the matched test device is simple; the operation is convenient; the technical conditions are stable; the consumption of a test rock sample or an on-site rock core can be greatly reduced under the condition that simulation requirements of a diamond bit dynamic grinding rock breaking process are met, and test cost is reduced.

The invention discloses a high-efficiency heat-conducting high-density fiberboard. The high-efficiency heat-conducting high-density fiberboard is composed of biomass fibers, a heat conduction materialand an additive, and the heat conduction material comprises tourmaline powder and aluminum oxide powder. The invention further discloses a manufacturing method of the high-efficiency heat-conductinghigh-density fiberboard. The preparation method comprises the following steps that fiber slurry is prepared; water mixture liquid of heat conduction material powder, surface modifier and partial adhesive are sprayed into the fiber slurry; the rest of the adhesive is continuously applied again and dried to obtain dried fibers; and after assembly and pre-pressing are performed on the dried fibers, the high-efficiency heat-conducting and high-density fiberboard is obtained through hot pressing, edge cutting, heat dissipation and growth and sanding. According to the high-efficiency heat-conductinghigh-density fiberboard, aluminum oxide powder and tourmaline powder are adopted as heat conduction materials, a pressurization spraying mode is adopted, and the heat conduction material powder and the fibers are highly dispersed by means of the pre-adhesion of the partial adhesive, so that the dispersion uniformity and stability of the heat conduction material are improved, and the heat transferefficiency of the high-density fiberboard is enhanced.

The invention discloses an aldehyde-free low-cost polysaccharide adhesive and a preparation method thereof. The aldehyde-free low-cost polysaccharide adhesive is prepared from the following componentsin parts by weight: 20-25 parts of a main agent, 55-60 parts of dispersed medium water, 6-16 parts of a crosslinking agent, 1-2 parts of a reinforcing agent and 1-3 parts of a viscosity regulator. The preparation method of the polysaccharide-based adhesive comprises the following steps: firstly, all the components are weighed according to the weight ratio, the reinforcing agent and the dispersedmedium water are mixed, and ultrasonic dispersion is conducted for 15 minutes; then, the main agent is added into a prepared solution, and a mixed solution is homogenized for 15 minutes under the pressure of 70 MPa through a high-pressure homogenizer; and finally, the crosslinking agent and the viscosity regulator are added into a mixture obtained in the second step successively, and even stirringis conducted. The adhesive prepared through the simple preparation method has the advantages of high crosslinking density, good water-resistance performance, high dry and wet strength, adjustable viscosity, low curing temperature and the like, the practical requirements for a plywood adhesive are met, the production cost is low, the preparation process is simple, large-scale mass production can be conducted, and development of the environment-friendly high-performance adhesive industry is promoted advantageously.

The invention discloses a camellia-oleifera-based particle board and a preparation method thereof. The camellia-oleifera-based particle board is a sandwich-structure particle board formed by sequentially compounding a surface layer, a core layer and a surface layer, and the surface layers and the core layer are formed in a manner that camellia oleifera fruit shell particles and wood shavings are taken as main raw materials, and an adhesive is added for gluing; and the adhesive is a melamine modified urea-formaldehyde resin adhesive. The camellia-oleifera-based particle board disclosed by the invention has good physical and mechanical properties; compared with a traditional wood particle board, the camellia-oleifera-based particle board has the advantages that recycling of agricultural and forestry waste is achieved; compared with wood, the camellia-oleifera-based particle board is lower in price; and compared with an existing camellia-oleifera-based particle board, the camellia-oleifera-based particle board has the advantages that production cost can be reduced, and environmental pollution can be reduced.

The invention discloses an impregnation type highly-heat-conducting nano-fluid adhesive. The adhesive comprises, by mass, 1 to 10% of metal nanoparticles, metal oxide nanoparticles or non-metal nanoparticles with a high heat conduction coefficient, 89 to 98.8% of an impregnation type resin adhesive, 0.1 to 0.5% of a surfactant or dispersing agent and 0.1 to 0.5% of an antifoaming agent. The above materials are mixed and then undergo ultrasonic concussion so as to form the impregnation type highly-heat-conducting nano-fluid adhesive. The invention also discloses a preparation method and application of the impregnation type highly-heat-conducting nano-fluid adhesive. The impregnation type highly-heat-conducting nano-fluid adhesive accords with the characteristic that the heat conduction coefficient of a nano-fluid substantially increases. As applied to preparation of artificial board decoration materials, the impregnation type highly-heat-conducting nano-fluid adhesive can be used for impregnating surface paper, wear-resistant paper, decoration paper, covering paper, bottom paper, recombinant decorative veneer, sliced veneer, rotary-cut veneer, fabrics and the like, and the adhesive can reduce predrying temperature for the above decorative materials after impregnation or shorten predrying time; and hot-pressing temperature can be decreased or hot-pressing time can be shortened when the predried impregnated decorative materials are used for decoration of the artificial boards.