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Anisotropic conductive rubber film comprising oxidation-reduction initiating system microcapsule and its preparation

An anisotropic, conductive adhesive film technology, applied in the direction of conductive adhesives, adhesives, film/sheet adhesives, etc., can solve the problems of reducing efficiency, increasing intermediate costs, transportation, storage, and inconvenient use , to achieve the effect of good process applicability, stable performance, and easy use in automated production lines

Inactive Publication Date: 2006-05-24
湖北省化学研究院
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the heat sensitivity of the adhesive film curing system, the ACF currently used in large quantities requires the product to be stored at low temperature to ensure its activity and bonding quality. Film curing activity affects device bonding quality
For example, Hitachi’s ACF storage temperature is -5~0℃, and Telephus’ ACF storage temperature is 0~5℃. Such low temperature storage conditions mean that the transportation and storage of products must be accompanied by refrigeration devices and ice packs. Storage and use bring great inconvenience, and greatly increase intermediate costs and reduce efficiency
Although the adhesive system disclosed in Chinese patent 00114692.0 can be stored at room temperature, it is only suitable for coating on thin film circuits and cannot be made into an adhesive film

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] According to the weight of the components described in the present invention, 100 parts of quality of unsaturated polyester resin, 5 parts of quality of microcapsule A, 1 part of quality of γ-glycidyl ether propyl trimethoxysilane, 0.5 parts of quality A homogeneous mixture of anti-aging agent 264, 30 parts by mass of conductive particles, and 358 parts by mass of ethyl acetate is spread on a 50 μm tetrafluoroethylene film to form a 25 μm film. After the solvent is evaporated and dried, it is cut into a certain width. Heterosexual conductive film. According to GB / T7122, use an intelligent electronic tensile machine to test the 90-degree peel strength of FPC and glass bonded by adhesive film. The test results are shown in Table 1.

Embodiment 2

[0035] According to the component weight of the present invention, 100 parts of quality vinyl resin, 7 parts of quality microcapsule B, 3 parts of quality γ-propyl methacrylate trimethoxysilane, 1.7 parts of quality anti-aging Agent RD, a uniform mixture of 35 parts by mass of conductive particles and 358 parts by mass of ethyl acetate is spread on a 50 μm tetrafluoroethylene film to form a 25 μm film, and after the solvent is evaporated and dried, it is cut into an anisotropic conductive film of a certain width. film. According to GB / T7122, use an intelligent electronic tensile machine to test the 90-degree peel strength of FPC and glass bonded by adhesive film. The test results are shown in Table 1.

Embodiment 3

[0037] According to the weight of the components described in the present invention, 100 parts of quality of maleamide resin, 8 parts of quality of microcapsule B, 2 parts of quality of γ-propyl methacrylate trimethoxysilane, 1.0 parts of quality of Anti-aging agent RD, a uniform mixture of 35 parts by mass of conductive particles and 358 parts by mass of ethyl acetate is spread on a 50 μm tetrafluoroethylene film to form a 25 μm film, and after the solvent is evaporated and dried, it is cut into a certain width of anisotropic Conductive film. According to GB / T7122, use an intelligent electronic tensile machine to test the 90-degree peel strength of FPC and glass bonded by adhesive film. The test results are shown in Table 1.

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Abstract

The invention discloses an anisotropy conductive lacquer containing oxidation reduction primosome system microcapsule. The feature is making the oxidation reduction primosome system to microcapsule and shielding its activity to achieve the effect of storing anisotropy conductive film in room temperature. The invention has advantages of high cementing reliability, good conductivity, and convenience using.

Description

technical field [0001] The invention relates to an anisotropic conductive adhesive film containing oxidation-reduction initiation system microcapsules and its preparation. Background technique [0002] Anisotropic Conductive Film (ACF) is a film-like conductive adhesive composed of an insulating component and a conductive component. The adhesive is cured during hot pressing, insulated in the xy plane direction, and conducted in the z vertical direction, thus realizing the connection of fine electronic circuits, such as liquid crystal glass and flexible circuits, flexible circuits and hard board circuits, integrated circuits and flexible circuits. Due to the heat sensitivity of the adhesive film curing system, the ACF currently used in large quantities requires the product to be stored at low temperature to ensure its activity and bonding quality. Film curing activity can affect the quality of device bonding. For example, Hitachi’s ACF storage temperature is -5~0℃, and Tele...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J9/02C09J7/00C09J123/04C09J133/00C09J135/00C09J167/06
Inventor 于洁王洛礼王琛
Owner 湖北省化学研究院
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