High-heat-conductive nano fluid adhesive, preparation method of same, and application thereof in production of artificial boards

Abstract

The invention discloses preparation of a high-heat-conductive nano fluid adhesive and an application thereof in production of artificial boards. The adhesive includes, by mass, 1-15% of high-heat conductivity metal nano particles, metal oxide nano particles or non-metal nano particles, 83-98.8% of an adhesive for production of a fiber board or a particle board, 0.1-1% of a surfactant or a dispersant, and 0.1-1% of a defoamer, all the components are mixed and are subjected to supersonic vibration to form the adhesive. The invention also discloses a preparation method of the adhesive and an application thereof in production of the artificial boards. The high-heat-conductive nano fluid adhesive has the character that the heat conductivity is significantly increased, so that the adhesive can significantly increase drying speed of the fibers and wood particles after application of the adhesive during production of the fiber board or the particle board, and meanwhile, can significantly reduce hot-pressing time or reduce the hot-pressing temperature of the fiber board or the particle board.

Description

technical field [0001] The invention belongs to the field of wood-based panel manufacturing, and in particular relates to a high thermal conductivity nanofluid adhesive, a preparation method and an application thereof. Background technique [0002] In 2014, my country released the "National Plan for Addressing Climate Change (2014-2020)", which proposed China's main goals and key tasks for addressing climate change before 2020, and submitted China's nationally determined plan to the Secretariat of the United Nations Framework Convention on Climate Change. The contribution document clarifies a series of goals such as that China's carbon dioxide emissions will peak around 2030 and strive to reach the peak as soon as possible, and that carbon dioxide emissions per unit of GDP in 2030 will be reduced by 60%-65% compared with 2005. At the same time, the environmental pressure faced by my country's economic and social development has been effectively transmitted to the wood-based p...

AI Technical Summary

Problems solved by technology

[0004] At present, the method of shortening the hot-pressing cycle in the production of wood-based panels is generally to use a curing agent that can promote the rapid curing of the adhesive, but the length of the hot-pressing cycle is not only determined by the curing time of the adhesive, but also limited by the sizing shavings or The drying speed of the fiber and the vaporization and removal speed of moisture during the hot pressing of the paved slab are not enough to shorten the curing time of the adhesive.

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