A Time-of-Flight Measurement Method Based on Ultrasonic Two-Dimensional Temperature Measuring Device
A technology of time-of-flight and temperature measuring devices, applied in measuring devices, measuring heat, thermometers, etc., can solve the problems of weak echo waveform display and analysis, slow response speed, poor flexibility, etc., and achieve high measurement accuracy and convenient maintenance , The effect of good interface interaction
Inactive Publication Date: 2018-01-30
CHONGQING UNIV
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Problems solved by technology
Ultrasonic temperature measurement technology will provide a non-contact, real-time, multi-dimensional temperature measurement method, which overcomes the shortcomings of thermocouples and thermal resistances that are not suitable for microwave environments and slow response speed; it breaks through the optical fiber contact and single-point temperature measurement limitations; avoiding the interference caused by the infrared method being easily affected by light
In recent years, the research on ultrasonic measurement system mainly takes the microcontroller as the core to realize the acquisition of ultrasonic echo signals and related algorithms, and realize the display of ultrasonic measurement data through VB, VC, Matlab and other software platforms, but the complex calculation of signals, echo The waveform display and analysis are relatively weak and less flexible
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[0029] The present invention will be further described below in conjunction with the accompanying drawings and embodiments, but it should not be understood that the scope of the subject matter of the present invention is limited to the following embodiments. Without departing from the above-mentioned technical ideas of the present invention, various replacements and changes made according to common technical knowledge and conventional means in this field shall be included in the protection scope of the present invention.
[0030] Such as figure 1 As shown, the ultrasonic two-dimensional temperature measurement device includes: a host computer, a single-chip microcomputer, a signal generator, an oscilloscope and an ultrasonic sensor. The host computer is connected and communicated with the single-chip microcomputer through a USB driver, and the data control port of the single-chip microcomputer is connected with the control terminal of the ultrasonic sensor. The ultrasonic se...
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Aiming at the requirements for precise measurement of ultrasonic wave travel time, the invention proposes a travel time measurement method based on an ultrasonic two-dimensional temperature measurement device. The method employs four ultrasonic sensors to construct a two-dimensional temperature measurement environment, designs a virtual instrument temperature testing system based on a LabVIEW software platform, and solves an envelope of a collected signal waveform, so as to extract an overall characteristic tendency of the collected signal waveform. The method obtains more accurate travel time through employing a cross-correlation algorithm, calculates a temperature mean value of a travel path according to an ultrasonic wave temperature measurement theory, compares the temperature mean value with an actual measurement value of a temperature instrument, and converts a temperature error into a travel time error. Through theoretical analysis and experiment verification, the travel time precision of the method reaches an ns level.
Description
technical field [0001] The invention relates to a temperature measurement method, which relates to a time-of-flight measurement method based on an ultrasonic temperature measurement device. Background technique [0002] The existing temperature measurement methods are mainly divided into two types, one is contact type and the other is non-contact type. Contact measurement requires long enough contact to reach thermal equilibrium. This method often destroys the thermal equilibrium state of the detected object and is eroded by the measured medium. Therefore, there are strict requirements on the structure and performance of the temperature sensing element, and this method is not suitable for measuring the temperature in a high temperature environment. The characteristics of non-contact temperature measurement are: no contact with the measured object, nor change the temperature distribution of the measured object, this method is superior to temperature measurement. [0003] Ul...
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IPC IPC(8): G01K11/24
Inventor 熊庆宇王丽洁王楷廖怡宁贾睿玺沈雪华石欣
Owner CHONGQING UNIV