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A chip-level white light LED and its manufacturing method

A manufacturing method and chip-level technology, applied in the field of white light LEDs, can solve problems such as difficulty in accurately controlling the thickness and shape of LED phosphor layers, low phosphor luminous efficiency, and uneven light field distribution, achieving good consistency and reducing production costs. The effect of cost and large lighting angle

Active Publication Date: 2018-08-14
SHENZHEN UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The thickness and shape of the LED phosphor layer produced by traditional methods are difficult to control accurately, resulting in uneven light field distribution, and because the LED chips are installed in a tube or substrate, when the LED emits light, only one surface emits light, resulting in fluorescence. The luminous efficiency of powder is low, and the waste of phosphor is serious

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  • A chip-level white light LED and its manufacturing method
  • A chip-level white light LED and its manufacturing method
  • A chip-level white light LED and its manufacturing method

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Embodiment Construction

[0020] see Figure 1-3 , figure 1 It is a schematic flowchart of the manufacturing method of the chip-level white light LED according to the first embodiment of the present invention. Such as figure 1 As shown, the manufacturing method of chip-level white light LED includes:

[0021] Step S10: Place a plurality of LED chips on the adhesive film at preset distances, and place them on the working table of the glue-spinning machine.

[0022] In step S10 , the flip-chip LED epitaxial wafer is placed on the adhesive film for compaction, and dicing and inversion are performed to obtain a plurality of LED chips closely attached to the adhesive film. Among them, the flip-chip LED epitaxial wafer is composed of many prepared LED chips, which need to be diced to obtain a single LED chip. In the embodiment of the present invention, the flip-chip LED epitaxial wafer is placed on the adhesive film for compaction, tightened on the support, then scribing, splitting, and then molded, and ...

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Abstract

The invention discloses a chip-level white light LED and a manufacturing method thereof. The method comprises the following steps of placing a plurality of LED chips on an adhesive film as a preset distance interval and placing on a photoresist spinner workbench; placing a predetermined amount of mixtures which are mixed with phosphor and a colloid on the plurality of LED chips; simultaneously starting a photoresist spinner so that the colloid uniformly covers a periphery of the plurality of LED chips; solidifying the mixtures mixed with the phosphor and the colloid so as to form a phosphor glue layer; cutting and acquiring a plurality of white light LEDs which are packaged in a single one mode. Through the above mode, by using the LED and the method, uniformity of a phosphor coating can be realized and a thickness is controllable; consistency is good and a luminescence angle is large; production cost can be reduced and the LED and the method are suitable for mass production.

Description

technical field [0001] The invention relates to the field of white light LEDs, in particular to a chip-level white light LED and a manufacturing method thereof. Background technique [0002] The manufacturing process of the existing white LED device based on the blue light emitting diode (light emitting diode, LED) chip is as follows: firstly, the LED chip is installed in a shell or a substrate, and after the electrodes are connected, coating or spotting is carried out in the shell or substrate. Spray yellow (or multi-color) fluorescent powder. The method of combining blue LED chips with yellow phosphor powder (PCLED, phosphor converted light emitting diode) is simple and easy to implement, and is the most widely used in research and application. A key technology for the realization of PCLED white light is the coating process of the phosphor layer. The thickness and shape of the phosphor layer directly affect the light uniformity, chromaticity consistency and output efficie...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/48H01L33/50
Inventor 柴广跃章锐华刘文熊龙杰肖充伊赵阳光曹志谭明
Owner SHENZHEN UNIV