Silicon wafer pickling and thinning machine

Abstract

The invention relates to a silicon chip pickling thinning machine comprising a box body and characterized in that a rotary hand basket is supported in the box body and is composed of two circular fixing plates, a cylindrical enclosures transversely connected between the two circular fixing plates, rotating shafts, and handles, wherein the rotating shafts and the handles are arranged on the outer side surfaces of the circular fixing plates; the cylindrical enclosure is composed of an enclosure body and a semicircular enclosure cover hinged to the enclosure body; the opening side edge of the semicircular enclosure cover is connected with the cylindrical enclosure by a lock; multiple ribs are uniformly arranged on the bottom of the enclosure body at intervals; a slideway is fixed to one end of the outer side of the box body, a support base is in sliding connection with the top of the slideway; an inverted servo motor is fixed to the horizontal plate surface of the support base; the motor shaft of the servo motor is connected with the rotating shafts of the rotary hand basket through a transmission mechanism, and a circulating water pipe is fixed to the inner sidewall of the box body. The silicon chip pickling thinning machine is reasonable in structural design and easy to operate, achieves single-side chemical thinning on a silicon chip and a large batch production, increases yield, saves resources, and reduces production cost.

Description

technical field [0001] The invention relates to a silicon wafer chemical thinning technology, in particular to a silicon wafer pickling and thinning machine. Background technique [0002] Silicon wafer thinning technology is mainly used in the production process of 6500V high-voltage series silicon controlled rectifiers, rectifier diodes, and high-density diodes. The function of single-sided thinning is to increase the surface millivolts on one side of silicon wafers, so as to facilitate the next step of phosphorus diffusion. The successful completion of the process. At present, other domestic enterprises are adopting the conventional thinning process, that is, thinning with a grinding machine, which has the following problems: the uniformity of thinning is poor, the subtracted thickness is difficult to accurately control, and it is easy to fragment, and after diamond grinding, impurities are introduced, causing The surface state of silicon wafers is difficult to control. ...

AI Technical Summary

Problems solved by technology

At present, other domestic enterprises are adopting the conventional thinning process, that is, thinning with a grinding machine, which has the following problems: the uniformity of thinning is poor, the subtracted thickness is difficult to accurately control, and it is easy to fragment, and after diamond grinding, impurities are introduced, causing The surface state of silicon wafers is difficult to control

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