Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Copper alloy for electronic and electrical equipment, plastically worked copper alloy material for electronic and electrical equipment, and component and terminal for electronic and electrical equipment

一种电子电气、塑性加工的技术，应用在热处理设备、金属材料涂层工艺、制造工具等方向，能够解决产品成品率降低、夹杂物、加工易产生缺陷等问题，达到抑制缺陷的产生、力学性能优异的效果

Inactive Publication Date: 2016-03-09
MITSUBISHI MATERIALS CORP
View PDF6 Cites 6 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0015] Here, when there are a large amount of coarse inclusions such as oxides inside the copper alloy for electrical and electronic equipment, there is a problem that defects due to these inclusions and the like are generated, and the product yield is greatly reduced.
In particular, Mg is an active element, so in the above-mentioned Cu-Mg alloy, there is a tendency that inclusions originating from Mg tend to be generated, and defects are likely to be generated during processing.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Copper alloy for electronic and electrical equipment, plastically worked copper alloy material for electronic and electrical equipment, and component and terminal for electronic and electrical equipment
  • Copper alloy for electronic and electrical equipment, plastically worked copper alloy material for electronic and electrical equipment, and component and terminal for electronic and electrical equipment
  • Copper alloy for electronic and electrical equipment, plastically worked copper alloy material for electronic and electrical equipment, and component and terminal for electronic and electrical equipment

Examples

Experimental program
Comparison scheme
Effect test

no. 1 approach

[0058] In the component composition of the copper alloy for electrical and electronic equipment according to this embodiment, Mg is contained in the range of 1.3% by mass to 2.8% by mass, and the remainder is actually Cu and unavoidable impurities, so-called Cu-Mg binary. Elemental alloys.

[0059] In addition, in the copper alloy for electronic and electrical equipment according to the present embodiment, the 0.2% yield strength is set to 400 MPa or more.

[0060] Here, when the content of Mg is defined as A atomic %, the electrical conductivity σ (%IACS) is set to σ≤1.7241 / (-0.0347×A 2 +0.6569×A+1.7)×100.

[0061] In addition, under scanning electron microscope observation, the average number of intermetallic compounds whose main components are Cu and Mg having a particle size of 0.1 μm or more is 1 piece / μm 2 the following.

[0062] That is, the copper alloy for electrical and electronic equipment according to the present embodiment is a Cu-Mg supersaturated solid soluti...

no. 2 approach

[0135] Next, the copper alloy for electrical and electronic devices according to the second aspect of the present invention will be described.

[0136] The composition of the copper alloy for electronic and electrical equipment according to this embodiment contains Mg in the range of 1.3% by mass to 2.8% by mass, and the remainder is actually Cu and unavoidable impurities, so-called Cu-Mg binary system. alloy.

[0137] In addition, in the copper alloy for electronic and electrical equipment according to the present embodiment, the contents of H, O, S, and C as impurity elements are specified as follows.

[0138] H: 10 mass ppm or less

[0139] O: 100 mass ppm or less

[0140] S: 50 mass ppm or less

[0141] C: 10 mass ppm or less

[0142] In addition, in the copper alloy for electrical and electronic equipment of the present embodiment, the X-ray diffraction intensity from the {111} plane on the plate surface is I{111}, and the X-ray diffraction intensity from the {200} pl...

no. 3 approach

[0158] Next, a copper alloy for electronic and electrical equipment according to a third embodiment of the present invention will be described.

[0159] The composition of the copper alloy for electrical and electronic equipment according to the present embodiment contains Mg in the range of 1.3% by mass to 2.8% by mass, and the remainder is actually Cu and unavoidable impurities, so-called binary Cu-Mg. Department of alloys.

[0160] In addition, in the copper alloy for electronic and electrical equipment according to the present embodiment, the contents of H, O, S, and C as impurity elements are specified as follows.

[0161] H: 10 mass ppm or less

[0162] O: 100 mass ppm or less

[0163] S: 50 mass ppm or less

[0164] C: 10 mass ppm or less

[0165] In addition, the copper alloy for electrical and electronic equipment of the present embodiment may be configured such that the yield ratio YS / TS calculated from the strength TS and the 0.2% yield strength YS when a tensil...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
particle diameteraaaaaaaaaa
directional tensile yield strengthaaaaaaaaaa
particle diameteraaaaaaaaaa
Login to View More

Abstract

The present invention provides a copper alloy for electronic and electrical equipment that has superior mechanical characteristics and the ability to suppress occurrences of defects even when processed to a thin plate thickness or a fine wire diameter, plastically worked copper alloy material for electronic and electrical equipment, and a component and terminal for electronic and electrical equipment. This copper alloy for electronic and electrical equipment is characterized by including Mg in a range of 1.3 - 2.8 mass%, with the remainder being substantially Cu and inevitable impurities, and is characterized by the H content being 10 mass ppm or less, the O content being 100 mass ppm or less, the S content being 50 mass ppm or less, and the C content being 10 mass ppm or less.

Description

technical field [0001] The present invention relates to a copper alloy for electrical and electronic equipment used as a terminal of a connector of a semiconductor device, a movable conductive piece of an electromagnetic relay, or a component for an electrical and electronic equipment such as a lead frame, and a copper alloy for an electrical and electronic equipment using the copper alloy for an electrical and electronic equipment Copper alloy plastic processing materials for electrical and electronic equipment, components and terminals for electrical and electronic equipment. [0002] This application claims priority based on patent application No. 2013-159642 filed in Japan on July 31, 2013, and patent application No. 2014-117998 filed in Japan on June 6, 2014, and the contents thereof are cited in this. Background technique [0003] Conventionally, with the miniaturization of electronic equipment and electrical equipment, etc., components for electrical and electronic e...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C22C9/00C22F1/08H01R4/58C22F1/00
CPCC22F1/00H01R4/58C22C9/00C21D8/00C21D9/0068Y02P10/20C22F1/08C23C30/005H01R13/03
Inventor 伊藤优树牧一诚
Owner MITSUBISHI MATERIALS CORP
Features
  • Generate Ideas
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com