A sn-ag-cu low-silver lead-free solder containing nd, re, in
A lead-free solder and solder technology, used in welding/cutting media/materials, welding media, metal processing equipment, etc. The effect of creep resistance, growth inhibition and improvement of mechanical properties of lead-free solder
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0032] A Sn-Ag-Cu low-silver lead-free solder containing Nd, Re, and In, including the following components: Ag content of 0.1 wt.%, Cu content of 0.5 wt.%, and Re content of 0.001 wt.% , Nd content is 0.001 wt.%, In content is 0.001 wt.%, and the balance is Sn, which is directly mixed and smelted under the protection of nitrogen to prepare solder.
Embodiment 2
[0034] A Sn-Ag-Cu low-silver lead-free solder containing Nd, Re and In, including the following components: Ag content of 1.0 wt.%, Cu content of 2.0 wt.%, and Re content of 0.25 wt.% , Nd content is 0.1 wt.%, In content is 0.2 wt.%, the balance is Sn, and it is directly mixed and smelted under the protection of nitrogen to prepare solder.
Embodiment 3
[0036] A Sn-Ag-Cu low-silver lead-free solder containing Nd, Re, In, including the following components: Ag content of 0.2wt.%, Cu content of 0.6wt.%, Re content of 0.06wt. %, Nd content is 0.05 wt.%, In content is 0.1 wt.%, the balance is Sn, and the brazing filler metal is directly mixed and smelted under the protection of nitrogen.
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com