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Manufacturing method of semi-flexible copper clad laminate

A manufacturing method and technology of copper clad laminates, applied in chemical instruments and methods, lamination auxiliary operations, lamination devices, etc., can solve the problems of poor dimensional stability of glass fiber cloth, unqualified PCB boards, affecting product quality, etc. Quality and performance, ensure product quality, avoid poor impregnation effects

Active Publication Date: 2017-11-03
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] (1) Due to the weaving structure of the conventional glass fiber cloth itself, its glass filaments are easily subjected to slight uneven tension to cause gluing and weft skew during the lamination process, resulting in poor dimensional stability of the glass fiber cloth, serious warping and appearance. The appearance is uneven, which further makes it easy to cause problems such as warping of the board due to extrusion deformation during the lamination process;
[0006] (2) Due to the interweaving of warp and weft yarns in the woven glass fiber cloth, gaps appear between yarns and yarns (ie, warp yarns and weft yarns, warp yarns and warp yarns, weft yarns and weft yarns). Larger and more, leading to poor impregnation of glass fiber cloth, which in turn affects the quality of semi-flexible copper clad laminates, resulting in serious ion migration (CAF) problems in PCB boards using the glass fiber cloth, resulting in unqualified PCB boards;
[0007] (3) When making thin semi-flexible copper-clad laminates, the above-mentioned defects will be magnified, which will seriously affect the quality of the product. Therefore, it is very difficult to make thin semi-flexible copper-clad laminates using existing methods

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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  • Manufacturing method of semi-flexible copper clad laminate
  • Manufacturing method of semi-flexible copper clad laminate
  • Manufacturing method of semi-flexible copper clad laminate

Examples

Experimental program
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Effect test

Embodiment 1

[0057] Through the above-mentioned first production method (such as figure 1 , 2 shown) to produce 106 shaped cloth, that is, glass raw materials are drawn to form glass filaments, and at least two glass filaments are paralleled to form glass filaments, and then resin composed of epoxy resin, curing agent and toughening agent is used The composition solution is used to impregnate the glass strands. After the impregnation, it is dried and semi-cured, and then twisted, warped, and weaved according to the specifications of 106 sizing cloths. After the weaving, it is dried in an oven at 170°C. After curing for 90 minutes, a 106 shaped cloth is obtained, and the resin weight content in the 106 shaped cloth does not exceed 30%. Subsequently, the 106 shaped cloth is dipped in a resin composition solution composed of epoxy resin, curing agent and toughening agent, etc. for impregnation treatment, and the 106 shaped cloth after the dipping treatment is baked in an oven at 155° C. for ...

Embodiment 2

[0059] Through the second production method above (such as figure 1 , 3 shown) to produce 106 shaped cloths. Specifically, glass raw materials are drawn to form glass filaments, at least two glass filaments are paralleled to form glass filaments, and the glass filaments are sequentially twisted and warped to form Warp the warp yarn, and then use a resin composition solution composed of epoxy resin, curing agent and toughening agent to impregnate the warp yarn, dry and semi-cure the warp yarn after the dipping treatment, and then carry out according to the specifications of 106 sizing cloth Weaving treatment, after the weaving treatment, bake in an oven at 170°C for 90 minutes and solidify to obtain 106 shaped cloth, the weight content of resin in the 106 shaped cloth is not more than 30%. Subsequently, the 106 shaped cloth is dipped in a resin composition solution composed of epoxy resin, curing agent and toughening agent, etc. for impregnation treatment, and the 106 shaped c...

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PUM

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Abstract

The invention discloses a making method of a semi-flexible copper-clad plate. The method comprises the following steps: 1, melting a glass raw material, and carrying out wire drawing treatment on the molten glass raw material to form fiberglass; 2, impregnating the fiberglass in a glue solution to carry out impregnation treatment, taking out the impregnated fiberglass, carrying out drying semi-solidifying treatment, and braiding the dried semi-solidified fiberglass to form a 106 glass fiber cloth blank; 3, carrying out baking solidification on the 106 glass fiber cloth blank to form a 106 formed cloth, wherein the weight content of resin in the 106 formed cloth does not exceed 30%; 4, impregnating the 106 formed cloth in the glue solution to carry out impregnation treatment; 5, baking the impregnated 106 formed cloth in an oven to form prepregs; and 6, respectively covering the upper surface and the lower surface of each of the prepregs with a 18[mu] electrolytic copper foil, and laminating the prepregs and the 18[mu] electrolytic copper foils in a vacuum press to form the semi-flexible copper-clad plate. The semi-flexible copper-clad plate made through using the method has the advantages of stable dimension, flat surface, and improved quality and performances.

Description

technical field [0001] The invention relates to the technical field of production of semi-flexible copper-clad laminates, in particular to a method for manufacturing semi-flexible copper-clad laminates by using 106 sizing cloth. Background technique [0002] With the miniaturization and multi-function of electronic products, especially the miniaturization and high performance of consumer electronic products has become an obvious trend, which requires printed circuit boards (Printed Circuit Board, PCB) for electronic products ) to achieve high density and high performance. Under this premise, flexible printed circuit boards (Flexible Printed Circuit Board, FPCB) and rigid-flexible boards have shown advantages. These special-structured PCB boards can significantly reduce the volume occupied by electronic products and achieve dense assembly and three-dimensional assembly. [0003] At present, the reinforcing material used in the flexible copper clad laminate (FCCL) used to man...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B37/10B32B37/15B32B38/00B32B38/08B32B38/16
CPCB32B37/1018B32B37/153B32B38/0036B32B38/08B32B38/164
Inventor 汪青伍宏奎茹敬宏刘东亮王克峰
Owner GUANGDONG SHENGYI SCI TECH
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