Regeneration and recycling technology for acid copper chloride etching waste liquid

A technology of etching waste liquid and copper chloride, which is applied in the regeneration and recovery process of acidic copper chloride etching waste liquid, and can solve the problems of high management difficulty, environmental pollution, and large amount of chemical waste liquid.

Inactive Publication Date: 2016-03-30
叶涛
View PDF6 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the cost of the electrolysis method is high, and the highly toxic chlorine gas produced during the electrolysis process may leak and pollute the environment, making management difficult
[0013] To sum up, the cost of the existing waste etching liquid recovery proces

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Regeneration and recycling technology for acid copper chloride etching waste liquid
  • Regeneration and recycling technology for acid copper chloride etching waste liquid
  • Regeneration and recycling technology for acid copper chloride etching waste liquid

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0111] A kind of regeneration process of acid copper chloride etching solution, comprises the following steps:

[0112] 1. Replacement: Take 500mL of etching waste liquid, and use the titration method to detect that the concentration of copper ions in the etching waste liquid is 1.9mol / L, and the concentration of ferric ion is 0.14mol / L; put 55g of iron powder into the etching waste liquid , and stir until no more bubbles are produced;

[0113] 2. Filtration: After the mixture obtained in step 1 is cooled to room temperature, it is filtered to obtain filtrate A and filter residue B;

[0114] 3. Clean the filter residue: place the filter residue B obtained in step 2 in excess 5M hydrochloric acid and react until no bubbles are produced; after the resulting mixture is cooled to room temperature, filter it quickly to obtain filtrate C and filter residue D; the composition of filter residue D is copper , analyzed by X-ray spectrometer, its purity is 92.8%; the quality of the copp...

Embodiment 2

[0118] A kind of regeneration process of acid copper chloride etching solution, comprises the following steps:

[0119] 1. Replacement: Take 500mL of etching waste liquid, and use the titration method to detect that the concentration of copper ions in the etching waste liquid is 0.01mol / L, and the concentration of ferric ion is 0.001mol / L; put 0.3g of iron into the etching waste liquid powder, and stir until no more bubbles are produced;

[0120] 2. Filtration: After the mixture obtained in step 1 is cooled to room temperature, it is filtered to obtain filtrate A and filter residue B;

[0121] 3. Clean the filter residue: put the filter residue B in an excess of 5M hydrochloric acid to react until no gas is produced; after the resulting mixture is cooled to room temperature, filter it quickly to obtain filtrate C and filter residue D; the composition of filter residue D is copper, and the X-ray Spectrometer analysis shows that its purity is 94.7%, which can be directly reused...

Embodiment 3

[0125] A kind of regeneration process of acid copper chloride etching solution, comprises the following steps:

[0126] 1. Replacement: Take 500mL of etching waste liquid and use the titration method to detect that the concentration of copper ions in the etching waste liquid is 0.2mol / L, and the concentration of ferric ion is 0.7mol / L; put 15.7g of iron into the etching waste liquid powder, and stir until no more bubbles are produced;

[0127] 2. Filtration: After the mixture obtained in step 1 is cooled to room temperature, it is filtered to obtain filtrate A and filter residue B;

[0128] 3. Clean the filter residue: place the filter residue B obtained in step 2 in excess 5M hydrochloric acid to react until no gas is produced; after the resulting mixture is cooled to room temperature, filter it quickly to obtain filtrate C and filter residue D; the composition of filter residue D is copper , analyzed by X-ray spectrometer, its purity is 95.1%, which can be directly reused; ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a regeneration technology for acid copper chloride etching waste liquid. The regeneration technology includes the steps of carrying out replacement and filtering, washing filter residues, preparing regeneration mixed liquid, and carrying out oxidation to form regeneration etching sub-liquid. According to the regeneration technology, toxic chlorine is not used, ingredients in the acid etching waste liquid can be sufficiently recycled, and a large amount of redundant chemical waste liquid is not generated. The invention further provides a recycling technology for the acid copper chloride etching waste liquid. The recycling technology includes the steps of replacement, filtering, filter residue washing and oxidation recycling. According to the recycling technology, toxic chlorine is not used, and a recycled solution with ferric trichloride as a main ingredient can serve as a wastewater treatment raw material to be recycled; and recycled copper can be directly reused.

Description

technical field [0001] The invention relates to a recovery and regeneration process of etching waste liquid, in particular to a regeneration and recovery process of acid copper chloride etching waste liquid. Background technique [0002] The etching process of the printed circuit board (PCB) is: spray the etching solution on the patterned copper plate made in the previous process, and use the oxidation-reduction reaction between the etching solution and the copper to remove the copper in the unprotected non-conductor part. etched away to form the lines. One of the most commonly used etching solutions in the etching process is acidic copper chloride etching solution, which includes hydrochloric acid, copper chloride and optional chloride etching aids, wherein copper chloride is the main copper etching agent. [0003] When copper chloride etching solution is used for etching, the common spray type automatic etching machine in industrial production is usually used for etching ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): C23F1/46
Inventor 叶涛
Owner 叶涛
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products