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Support film for wiring board manufacturing process

A wiring substrate and supporting film technology, applied in lamination devices, lamination, layered products, etc., can solve the problems of complicated supporting films, damaged wiring substrates, inability to completely peel off and remove, etc., and achieve simple peeling. removal effect

Active Publication Date: 2018-08-31
SOMAR CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this way, if a support film having high adhesion at room temperature after the plating treatment is used, the following problems will occur: when the support film is peeled and removed from the wiring board, it cannot be completely peeled or removed, or damage the wiring board
[0013] However, it is cumbersome to replace the attached support film in this way, and a support film that can cover all the processes with a single sheet is desired

Method used

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  • Support film for wiring board manufacturing process
  • Support film for wiring board manufacturing process
  • Support film for wiring board manufacturing process

Examples

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Effect test

Embodiment

[0063] Hereinafter, the present invention will be further described in detail based on examples. It should be noted that, in the present examples, "parts" and "%" are based on mass unless otherwise specified.

[0064] [Example and Comparative Example]

[0065] 1. (A) Synthesis of acrylic resin

[0066] In a reaction vessel equipped with a stirrer, a capacitor, a thermometer, and a nitrogen introduction tube, use ethyl acetate as a solvent, mix the monomer components shown in Table 1 and 0.15 parts of azobisisobutyronitrile, stir until uniform, and then Bubbling was performed at a flow rate of 100 ml / min for 60 minutes to degas the dissolved oxygen in the reaction system. Next, the temperature was raised to 80° C. over 1 hour, and after the temperature was raised, polymerization was performed for 4 hours. Thereafter, the temperature was raised to 90° C. over 1 hour, and further kept at 90° C. for 1 hour, and then cooled to room temperature. Next, toluene was added and adjus...

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Abstract

The present invention provides a support film for a wiring board manufacturing process, which can cover all processes with a single support film and can be easily peeled off and removed at normal temperature after use. The supporting film for a wiring board manufacturing process of the present invention is a supporting film for a wiring board manufacturing process having an adhesive layer on at least one surface of a base film, and is characterized in that the adhesive layer has a glass transition temperature of 10° C. to 35°C, and is formed of at least (A) acrylic resin and (B) crosslinking agent, (A) acrylic resin is composed of at least (A‑1) ethyl methacrylate, (A‑2) Furthermore, it is a copolymer composed of a (meth)acrylate having an alkyl group having 2 to 8 carbon atoms and (A-3) a monomer having an ethylenically unsaturated double bond.

Description

technical field [0001] The present invention relates to a support film that is attached to a wiring board in the manufacturing process of a wiring board, and particularly relates to a wiring that can be manufactured with a single support film from exposure to plating in the manufacturing process of a flexible wiring board. Support film for substrate manufacturing process. Background technique [0002] figure 1 An example of a conventional process is shown in which a plating layer is partially formed on a circuit pattern of a wiring board using two supporting films. figure 1 A is an example of a schematic cross-sectional view of the first support film, figure 1 H is an example of a schematic cross-sectional view of the second support film. [0003] First, the dry film resist 5 and the first support film 10 are thermally laminated on a flexible printed circuit board (hereinafter sometimes referred to as FPC) 20 as a wiring board at a temperature of 60° C. to 120° C., thereb...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B37/06B32B37/12B32B17/06B32B7/12
Inventor 林虎雄
Owner SOMAR CORP
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